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<p>In this paper, the Sn-0.7Cu-0.1Ni-1.0Zn lead-free solder was prepared at various withdrawal rates (10, 60, 100 and 150&#xa0;μm/s) by directional solidification. To systematically evaluate the effect of withdrawal rates on phase formation and microstructural evolution, the samples were characterized using optical microscopy (OM), x-ray diffraction (XRD), and scanning electron microscopy (SEM) with energy-dispersive spectroscopy (EDS). Differential scanning calorimetry (DSC) was employed to determine the melting characteristics. Then the wettability property, thermal behavior and mechanical properties were investigated. The results indicated that the withdrawal rate refined the intermetallic phases within the microstructure. The wettability of the solder decreases first and then increases with the increase of withdrawal rate, and it is better at 10&#xa0;μm/s. Ultimate tensile strength values reaches a peak at 60&#xa0;μm/s and then gradually decreases while the ductility changes on the contrary. According to the fracture morphology, more obvious ductile fracture characteristics can be observed at 10 and 150&#xa0;μm/s.</p>

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Experimental and Phase-Field Simulation for Optimizing Withdrawal Rate of Directionally Solidified Sn-0.7Cu-0.1Ni-1.0Zn Solder: Enhanced Wettability and Mechanical Properties

  • 期刊论文

  • 发表日期：

    2026年8月1日

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  • Dongdong Zhang,
  • Zhuhuan Yu,
  • Tianxiao Ma,
  • Junfeng Qiang,
  • Haiyan Lv,
  • Xiong Yang,
  • Zi Yang,
  • Xirui Shangguan

摘要

In this paper, the Sn-0.7Cu-0.1Ni-1.0Zn lead-free solder was prepared at various withdrawal rates (10, 60, 100 and 150 μm/s) by directional solidification. To systematically evaluate the effect of withdrawal rates on phase formation and microstructural evolution, the samples were characterized using optical microscopy (OM), x-ray diffraction (XRD), and scanning electron microscopy (SEM) with energy-dispersive spectroscopy (EDS). Differential scanning calorimetry (DSC) was employed to determine the melting characteristics. Then the wettability property, thermal behavior and mechanical properties were investigated. The results indicated that the withdrawal rate refined the intermetallic phases within the microstructure. The wettability of the solder decreases first and then increases with the increase of withdrawal rate, and it is better at 10 μm/s. Ultimate tensile strength values reaches a peak at 60 μm/s and then gradually decreases while the ductility changes on the contrary. According to the fracture morphology, more obvious ductile fracture characteristics can be observed at 10 and 150 μm/s.