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<p>The curing behavior of underfill adhesive is one of the key factors determining the reliability of micro-interconnections in flip-chip packaging. This study aims to systematically elucidate the structure-property relationship of epoxy-based underfill adhesive, spanning from chemical curing to macroscopic shear strength. By integrating non-isothermal and isothermal differential scanning calorimetry with in-situ attenuated total reflection–Fourier transform infrared (ATR–FTIR) spectroscopy, the characterization accuracy of various curing kinetic models for the curing behavior of the underfill adhesive was comparatively evaluated. The findings reveal that the <i>n</i>-th order curing kinetics model leads to significant fitting distortion due to its neglect of the inherent autocatalytic effect within the system. In contrast, the Sesták–Berggren and Kamal–Sourour models, which incorporate autocatalytic mechanisms, achieve substantial optimization in characterization performance. The model-free isoconversional method quantitatively reveals the competition mechanism between hydroxyl-induced autocatalysis and gelation-triggered diffusion-controlled stages, confirming the physical essence of the dynamic evolution of activation energy with the degree of curing. Furthermore, in-situ ATR–FTIR spectroscopic data provide robust evidence for the intrinsic consistency between macroscopic heat flow and microscopic functional group transformation. Crucially, the shear strength of the micro-interconnection joints exhibits an exponential non-linear growth with the degree of curing. Notably, during the cross-linking densification stage after the degree of curing transcends 0.95, the shear strength undergoes a significant leap of 48.39%. This study not only provides technical support for the high-precision measurement of the degree of curing for underfill adhesives, but also offers accurate curing kinetic parameters and mechanical testing methodologies for the precise regulation of curing behavior and the reliability assessment of micro-interconnections.</p>

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Study on Curing Behavior, Kinetic Modeling, and Shear Strength of Underfill Adhesive for Flip-Chip Micro-interconnections

  • 期刊论文

  • 发表日期：

    2026年7月24日

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  • Zhuangchao Zhan,
  • Yupeng Wang,
  • Quanzheng Tan,
  • Yifan Zhou,
  • Guixiang Xu,
  • Siliang He,
  • Daoguo Yang,
  • Hongbo Qin

摘要

The curing behavior of underfill adhesive is one of the key factors determining the reliability of micro-interconnections in flip-chip packaging. This study aims to systematically elucidate the structure-property relationship of epoxy-based underfill adhesive, spanning from chemical curing to macroscopic shear strength. By integrating non-isothermal and isothermal differential scanning calorimetry with in-situ attenuated total reflection–Fourier transform infrared (ATR–FTIR) spectroscopy, the characterization accuracy of various curing kinetic models for the curing behavior of the underfill adhesive was comparatively evaluated. The findings reveal that the n-th order curing kinetics model leads to significant fitting distortion due to its neglect of the inherent autocatalytic effect within the system. In contrast, the Sesták–Berggren and Kamal–Sourour models, which incorporate autocatalytic mechanisms, achieve substantial optimization in characterization performance. The model-free isoconversional method quantitatively reveals the competition mechanism between hydroxyl-induced autocatalysis and gelation-triggered diffusion-controlled stages, confirming the physical essence of the dynamic evolution of activation energy with the degree of curing. Furthermore, in-situ ATR–FTIR spectroscopic data provide robust evidence for the intrinsic consistency between macroscopic heat flow and microscopic functional group transformation. Crucially, the shear strength of the micro-interconnection joints exhibits an exponential non-linear growth with the degree of curing. Notably, during the cross-linking densification stage after the degree of curing transcends 0.95, the shear strength undergoes a significant leap of 48.39%. This study not only provides technical support for the high-precision measurement of the degree of curing for underfill adhesives, but also offers accurate curing kinetic parameters and mechanical testing methodologies for the precise regulation of curing behavior and the reliability assessment of micro-interconnections.