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<p>To address the requirement for soluble bridge plugs claw components in shale gas development to possess both high strength and controllable dissolution properties, 7075 aluminum alloy was considered as an alternative material due to its high strength. However, its natural dissolution rate in formation water still fails to meet the rapid dissolution standards required post-fracturing. This study uses electroless copper plating to tailor the dissolution behavior of 7075 aluminum alloy. Through weight loss tests and electrochemical tests including polarization curves, AC impedance spectroscopy, and cyclic voltammetry, this study examines the corrosion rates of surface multi-microporous copper plating specimens (CPS specimens) and no copper plating specimens (7075 Aluminum alloy specimens) after being loaded with 100% <i>σ</i><sub>s</sub> stress and immersed in simulated formation water at 90&#xa0;°C for 1, 3, and 7&#xa0;days. The results indicate that both CPS specimens and 7075 aluminum alloy specimens exhibit increasing corrosion rates over time, and CPS specimens corrode faster than 7075 aluminum alloy specimens under the same immersion duration. Therefore, the copper plating process significantly increases the corrosion rate of 7075 aluminum alloy in simulated formation water at 90&#xa0;°C.</p>

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The Effect of Surface Microporous Copper Plating on the Stress Corrosion Rate of 7075 Aluminum Alloy

  • 期刊论文

  • 发表日期：

    2026年7月6日

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  • Huakun Yang,
  • Xiaohong Wang,
  • Yang Liu,
  • Anjing Ren,
  • Xinhao Li,
  • Peiyao Wang,
  • Jing Yan

摘要

To address the requirement for soluble bridge plugs claw components in shale gas development to possess both high strength and controllable dissolution properties, 7075 aluminum alloy was considered as an alternative material due to its high strength. However, its natural dissolution rate in formation water still fails to meet the rapid dissolution standards required post-fracturing. This study uses electroless copper plating to tailor the dissolution behavior of 7075 aluminum alloy. Through weight loss tests and electrochemical tests including polarization curves, AC impedance spectroscopy, and cyclic voltammetry, this study examines the corrosion rates of surface multi-microporous copper plating specimens (CPS specimens) and no copper plating specimens (7075 Aluminum alloy specimens) after being loaded with 100% σs stress and immersed in simulated formation water at 90 °C for 1, 3, and 7 days. The results indicate that both CPS specimens and 7075 aluminum alloy specimens exhibit increasing corrosion rates over time, and CPS specimens corrode faster than 7075 aluminum alloy specimens under the same immersion duration. Therefore, the copper plating process significantly increases the corrosion rate of 7075 aluminum alloy in simulated formation water at 90 °C.