<p>The solidification parameters significantly influence the microstructure and performance of the Sn-8Sb-8Cu alloy. Conventional preparation methodologies encounter limitations in regulating these parameters and accurately ascertaining their resultant effects. Directional solidification technology enables precise regulation of these parameters. Therefore, the effect of directional solidification rate (<i>V</i> = 5, 10, 20, 50, and 100 μm/s) on the microstructure and properties of the alloy was systematically investigated. The microstructure of the Sn-8Sb-8Cu alloy consists of the Sn matrix, SnSb, and Cu₆Sn₅ phase. At <i>V</i> = 5 μm/s, the Cu₆Sn₅ phase is coarse and needle-like, and the SnSb phase hardly precipitates. At <i>V</i> = 10-20 μm/s, Cu₆Sn₅ dendrites refine and develop secondary dendrites, and the number of SnSb phases increases while their size decreases. At <i>V</i> = 50-100 μm/s, the dendrites are more uniformly distributed and refined. With increasing <i>V</i>, the microhardness of the <i>β</i>-Sn matrix increases by 62% (from 18.34 HV to 29.77 HV), whereas the hardness of the Cu₆Sn₅ phase decreases. At <i>V</i> = 10 μm/s, there is a significant wear amount (0.232 g) and a highly variable friction curve. At <i>V</i> ≥ 20 μm/s, the friction process becomes steady and the wear amount decreases to 0.015 g, almost 95% less than that of the as-cast specimen. Considering the <i>β</i>-Sn matrix hardness, wear amount, average friction coefficient, and friction-curve stability, the specimen solidified at <i>V</i> = 50 μm/s shows the best overall performance among the investigated rates.</p>