Response and Deformation Behavior of Cu-Pb-Sn Alloys with Different Microstructures to U-Type Die Bending Loads
摘要
This study investigated the U-type die bending behavior of Cu-Pb-Sn alloy obtained from Cu-Pb-Sn/C10 composite materials, from two directions: S1 (interface-proximal zone as the outer surface) and S2 (interface-distal zone as the outer surface). The microstructure observations and mechanical property tests combined with finite element analysis (FEA) were carried out to reveal the deformation mechanisms of Cu-Pb-Sn with varied morphologies. A significant grain size difference was identified, with the interface-proximal zone measuring 170 ± 58 μm and the interface-distal zone 383 ± 105 μm. S1, which positioned the finer-grained interface-proximal zone on the bending outer surface, remained crack-free throughout the process. In contrast, S2, with the coarse-grained interface-distal zone on the bending outer surface, experienced crack initiation at a punch displacement of 10 mm. Microscopic analysis revealed that cracks are prone to nucleation at grain boundaries embrittled by Pb-rich phases, resulting in the overall fracture of Cu-Pb-Sn alloy. Finite element analysis confirmed that the peak tensile strain appeared in the center of S1 at approximately 10 mm of punch displacement, which agreed well with the experimental findings. This study addresses a key research gap and provides practical guidance for the forming of leaded bronze bearing shells.