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<p>Lightweight Mg alloys combined with radiation-shielding Ta hold promise for multifunctional aerospace laminates, but direct bonding is hindered by immiscibility, large melting point disparity, and crystal structure mismatch. Here, a two-step Cu-interlayer diffusion bonding strategy is developed to overcome these challenges. Bonding below the Mg-Cu eutectic temperature (485&#xa0;°C) forms a layered interface containing brittle Mg<sub>2</sub>Cu, limiting shear strength to 20.5&#xa0;MPa. At 500&#xa0;°C, a solid-liquid eutectic reaction (L ↔ α-Mg + Mg<sub>2</sub>Cu) reconstructs the interface into a ~ 100-μm-thick multiphase layer, eliminating voids and raising shear strength to 55&#xa0;Mpa—nearly five times that of direct Mg/Ta bonding. This work not only enables high-strength Mg/Ta joints but also, for the first time, elucidates the influence of the interlayer and bonding temperature on interface evolution, providing a feasible route for fabricating lightweight, radiation-shielding dissimilar laminates.</p>

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Enhanced Bonding of Immiscible Mg/Ta Systems via Cu-Interlayer-Assisted Two-Step Thermomechanical Processing

  • 期刊论文

  • 发表日期：

    2026年1月20日

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  • Zhilei Yu,
  • Jingli Li,
  • Zhiyong Xue

摘要

Lightweight Mg alloys combined with radiation-shielding Ta hold promise for multifunctional aerospace laminates, but direct bonding is hindered by immiscibility, large melting point disparity, and crystal structure mismatch. Here, a two-step Cu-interlayer diffusion bonding strategy is developed to overcome these challenges. Bonding below the Mg-Cu eutectic temperature (485 °C) forms a layered interface containing brittle Mg2Cu, limiting shear strength to 20.5 MPa. At 500 °C, a solid-liquid eutectic reaction (L ↔ α-Mg + Mg2Cu) reconstructs the interface into a ~ 100-μm-thick multiphase layer, eliminating voids and raising shear strength to 55 Mpa—nearly five times that of direct Mg/Ta bonding. This work not only enables high-strength Mg/Ta joints but also, for the first time, elucidates the influence of the interlayer and bonding temperature on interface evolution, providing a feasible route for fabricating lightweight, radiation-shielding dissimilar laminates.