<p>The integration of mechanical reliability, thermal management, and advanced manufacturing is becoming increasingly crucial in the development of high-performance polymeric components for engineering applications. In this study, photopolymer-based nanocomposites reinforced with hollow silica (SiO₂) nanoparticles were fabricated using digital light processing (DLP) 3D printing, aiming to enhance both mechanical integrity and thermal performance. A Bis-GMA/TEGDMA resin system was modified with 1, 3, and 5 wt.% of hollow silica nanoparticles, and the influence of filler loading on tensile properties and thermal behavior was systematically investigated. The porous structure of the hollow nanoparticles effectively promoted phonon scattering, leading to a notable reduction in thermal conductivity and diffusivity. The composites showed a nonlinear correlation between filler concentration and thermal properties due to particle dispersion and interfacial effects, as confirmed by SEM, FTIR, and TGA analyses. Tensile tests revealed an improvement in strength and Young’s modulus with increasing filler up to 3 wt.%, with a peak tensile strength of 70.9&#xa0;MPa, compared to 56.1&#xa0;MPa for the neat resin. However, a slight decrease was observed at 5 wt.% due to nanoparticle agglomeration. Elongation at break decreased with filler content, indicating reduced ductility. These results demonstrate the potential of DLP-fabricated hollow silica nanocomposites for lightweight structural components with enhanced thermal insulation in mechanical systems.</p>