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<p>The addition of copper into electroless Ni-P plating (Ni-Cu-P) has shown enhanced thermal stability, deposition rate, and corrosion resistance compared to electroless Ni-P plating. Herein, the present work explores the effect of annealing temperatures (room temperature, 100, 120, 200 °C) on the characteristics of Ni-0.1Cu-P coating applied on stir-cast Al-Cu-Mg alloy, mitigating the saltwater corrosion in 0.1 molar NaCl solution. The microstructural evolution, adhesive strength, and scratch resistance, of Ni-0.1Cu-P coatings were thoroughly studied employing x-ray diffraction, field emission scanning electron microscopy, energy-dispersive x-ray spectroscopy, atomic force microscopy, and optical surface profilometry, revealing the formation of few microns thick, homogeneous, amorphous coatings that was bright, dense, and compact, featuring a smooth grain structure. Importantly, no morphological changes were observed after the heat treatment (100, 120 and 200 °C). Potentiodynamic polarization by Tafel extrapolation illustrates that Ni-0.1Cu-P specimen annealed at 120&#xa0;°C (HT-120&#xa0;°C) showed improved corrosion resistance, as evidenced by lowest corrosion current density (<i>i</i><sub>corr</sub> ~ 0.27&#xa0;μA&#xa0;cm<sup>−2</sup>) and highest polarization resistance (<i>R</i><sub><i>p</i></sub> ~ 111370 Ω.cm<sup>2</sup>) among entire specimens. Mott-Schottky analysis confirms that the formation of p-n junction bipolar passive film in HT-120&#xa0;°C specimen was the dominant factor for improved corrosion resistance. The passive film lowers the donor carrier density (<i>N</i><sub><i>d</i></sub>: ~ 4.99 × 10<sup>18</sup>), acting as a barrier, effectively inhibiting the ingress of chloride ions and outward diffusion of cations formed during anodic dissolution, improving corrosion resistance in saline water.</p>

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Effect of Annealing Temperatures of Ni-0.1Cu-P Electroless Plating on the Corrosion Behavior of Al-Cu-Mg Alloy

  • 期刊论文

  • 发表日期：

    2025年10月20日

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  • Yogendra Mahton,
  • Meeta Ashok Kamde,
  • Partha Saha

摘要

The addition of copper into electroless Ni-P plating (Ni-Cu-P) has shown enhanced thermal stability, deposition rate, and corrosion resistance compared to electroless Ni-P plating. Herein, the present work explores the effect of annealing temperatures (room temperature, 100, 120, 200 °C) on the characteristics of Ni-0.1Cu-P coating applied on stir-cast Al-Cu-Mg alloy, mitigating the saltwater corrosion in 0.1 molar NaCl solution. The microstructural evolution, adhesive strength, and scratch resistance, of Ni-0.1Cu-P coatings were thoroughly studied employing x-ray diffraction, field emission scanning electron microscopy, energy-dispersive x-ray spectroscopy, atomic force microscopy, and optical surface profilometry, revealing the formation of few microns thick, homogeneous, amorphous coatings that was bright, dense, and compact, featuring a smooth grain structure. Importantly, no morphological changes were observed after the heat treatment (100, 120 and 200 °C). Potentiodynamic polarization by Tafel extrapolation illustrates that Ni-0.1Cu-P specimen annealed at 120 °C (HT-120 °C) showed improved corrosion resistance, as evidenced by lowest corrosion current density (icorr ~ 0.27 μA cm−2) and highest polarization resistance (Rp ~ 111370 Ω.cm2) among entire specimens. Mott-Schottky analysis confirms that the formation of p-n junction bipolar passive film in HT-120 °C specimen was the dominant factor for improved corrosion resistance. The passive film lowers the donor carrier density (Nd: ~ 4.99 × 1018), acting as a barrier, effectively inhibiting the ingress of chloride ions and outward diffusion of cations formed during anodic dissolution, improving corrosion resistance in saline water.