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<p>Copper foils are widely used in microelectronics and microfabrication industries due to their excellent electrical conductivity, ductility, and mechanical reliability. Multi-pass micro-rolling is an effective method to fabricate micro-/meso-scale copper products with superior mechanical performance. However, the effect of annealing temperature on grain size evolution, tensile properties, and edge crack formation of copper foils during micro-rolling remains insufficiently explored. The experimental results in this work reveal a strong correlation between annealing temperature, microstructure, and formability. The elongated grains change to recrystallized equiaxed grains, and the grain size increases as the annealing temperature increases from 300 to 700&#xa0;°C. The tensile strength of annealed copper foils decreases as the annealing temperature increases from 300 to 700&#xa0;°C. The elongation increases to a peak value of 25% as the annealing temperature rises from 300 to 500&#xa0;°C and then decreases to 20% when the annealing temperature further increases to 700&#xa0;°C. An optimal annealing temperature of 500&#xa0;°C results in a refined microstructure with a weak cube texture, a large fraction of high-angle grain boundaries (HAGBs), and low dislocation density, which improves the formability and the resistance to edge cracking of copper foils. These findings contribute to a deeper understanding of the interplay between rolling parameters, microstructure, and mechanical performance of copper foils, providing valuable insights for optimizing micro-rolling processes for industrial applications.</p>

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Effect of Annealing Temperature on the Formability of Copper Foils during Multi-Pass Micro-Rolling Process

  • 期刊论文

  • 发表日期：

    2025年10月13日

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  • Jingwei Zhao,
  • Muhammad Arfan,
  • Chen Wang,
  • Weidong Zhao,
  • Xiaoguang Ma,
  • Zhengyi Jiang,
  • Lingjian Meng

摘要

Copper foils are widely used in microelectronics and microfabrication industries due to their excellent electrical conductivity, ductility, and mechanical reliability. Multi-pass micro-rolling is an effective method to fabricate micro-/meso-scale copper products with superior mechanical performance. However, the effect of annealing temperature on grain size evolution, tensile properties, and edge crack formation of copper foils during micro-rolling remains insufficiently explored. The experimental results in this work reveal a strong correlation between annealing temperature, microstructure, and formability. The elongated grains change to recrystallized equiaxed grains, and the grain size increases as the annealing temperature increases from 300 to 700 °C. The tensile strength of annealed copper foils decreases as the annealing temperature increases from 300 to 700 °C. The elongation increases to a peak value of 25% as the annealing temperature rises from 300 to 500 °C and then decreases to 20% when the annealing temperature further increases to 700 °C. An optimal annealing temperature of 500 °C results in a refined microstructure with a weak cube texture, a large fraction of high-angle grain boundaries (HAGBs), and low dislocation density, which improves the formability and the resistance to edge cracking of copper foils. These findings contribute to a deeper understanding of the interplay between rolling parameters, microstructure, and mechanical performance of copper foils, providing valuable insights for optimizing micro-rolling processes for industrial applications.