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<p>With the rapid advancement of industrial applications, the demand for high-performance copper alloys has significantly increased. Copper alloys combining high strength, superior electrical conductivity, and excellent wear resistance are urgently required in modern industries. To balance the mechanical properties and electrical conductivity of the hot-rolled Cu-1.0Cr-0.1Zr alloy, the effects of annealing and aging treatments on its comprehensive performance were systematically investigated. The results demonstrate that the alloy rolled at 780&#xa0;°C (with a rolling reduction of 90%) exhibits remarkable improvement in overall properties after short-time annealing. Microstructural and mechanical analyses reveal that increasing the annealing temperature promotes grain regrowth within the copper matrix and enhances recrystallization, thereby strengthening the alloy’s performance. Furthermore, subsequent aging treatment reduces dislocation density and defects in the alloy while diminishing electron scattering barriers, leading to optimized electrical conductivity.</p>

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Effect of Annealing and Aging Treatment on Microstructure and Properties of High Deformation Hot-Rolled Cu-Cr-Zr Alloy

  • 期刊论文

  • 发表日期：

    2025年8月26日

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  • Peng Yan,
  • Guoqing Zu,
  • Jun Zha,
  • Fan Ye,
  • Weiwei Zhu,
  • Ying Han,
  • Haohao Zou,
  • Yu Zhao,
  • Mingyu Li,
  • Xu Ran

摘要

With the rapid advancement of industrial applications, the demand for high-performance copper alloys has significantly increased. Copper alloys combining high strength, superior electrical conductivity, and excellent wear resistance are urgently required in modern industries. To balance the mechanical properties and electrical conductivity of the hot-rolled Cu-1.0Cr-0.1Zr alloy, the effects of annealing and aging treatments on its comprehensive performance were systematically investigated. The results demonstrate that the alloy rolled at 780 °C (with a rolling reduction of 90%) exhibits remarkable improvement in overall properties after short-time annealing. Microstructural and mechanical analyses reveal that increasing the annealing temperature promotes grain regrowth within the copper matrix and enhances recrystallization, thereby strengthening the alloy’s performance. Furthermore, subsequent aging treatment reduces dislocation density and defects in the alloy while diminishing electron scattering barriers, leading to optimized electrical conductivity.