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<p>This study investigates the effects of incorporating CuO nanoparticles (NPs) on the microstructure, mechanical, thermal, and electrical properties of Sn-10Zn solder alloys. Varying concentration ratios of Sn-10Zn-xCuO NPs solder alloys (where x = 0, 0.07, 0.15, 0.3, 0.7, and 1.2 wt.%) were synthesized using the melt-spinning process. Microstructure analysis revealed that adding a trace amount of CuO NPs to the Sn-10Zn system refined the crystallite size of the tetragonal β-Sn and hexagonal α-Zn phases. Vickers microhardness peaked at 17.713 HV with 0.7 wt.% CuO NPs. The creep resistance parameter (<i>n</i>) exhibited an optimal balance between hardness and ductility at 0.3 and 0.7 wt.% of CuO NPs addition. Thermal analysis demonstrated a slight increase in melting temperature (T<sub>m</sub>) with CuO NPs addition, correlating with crystallite size modifications. Electrical resistivity (<i>ρ</i>) increased with CuO NPs content due to charge carrier scattering at the metal–semiconductor interface, leading to a decrease in electron concentration (<i>N</i>) and an increase in Fermi energy (E<sub><i>f</i></sub>) and Fermi velocity (V<sub><i>f</i></sub>). Overall, these findings demonstrated that the inclusion of CuO NPs was an effective strategy for enhancing the performance of new lead-free solder alloys, offering improved mechanical, thermal, and electrical properties.</p>

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CuO Nanoparticles-Driven Microstructure Evolution and Advanced Mechanical, Thermal, and Electrical Properties of Sn-10Zn Solder Alloys

  • 期刊论文

  • 发表日期：

    2025年8月1日

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  • Sallah A. Al Hashedi,
  • Hamed Al-Sorory,
  • Najeeb S. Al-zoreky,
  • Adil Alshoaibi,
  • Khaled M. A. Ramadan,
  • Zafar Iqbal,
  • A. Q. Alosabi

摘要

This study investigates the effects of incorporating CuO nanoparticles (NPs) on the microstructure, mechanical, thermal, and electrical properties of Sn-10Zn solder alloys. Varying concentration ratios of Sn-10Zn-xCuO NPs solder alloys (where x = 0, 0.07, 0.15, 0.3, 0.7, and 1.2 wt.%) were synthesized using the melt-spinning process. Microstructure analysis revealed that adding a trace amount of CuO NPs to the Sn-10Zn system refined the crystallite size of the tetragonal β-Sn and hexagonal α-Zn phases. Vickers microhardness peaked at 17.713 HV with 0.7 wt.% CuO NPs. The creep resistance parameter (n) exhibited an optimal balance between hardness and ductility at 0.3 and 0.7 wt.% of CuO NPs addition. Thermal analysis demonstrated a slight increase in melting temperature (Tm) with CuO NPs addition, correlating with crystallite size modifications. Electrical resistivity (ρ) increased with CuO NPs content due to charge carrier scattering at the metal–semiconductor interface, leading to a decrease in electron concentration (N) and an increase in Fermi energy (Ef) and Fermi velocity (Vf). Overall, these findings demonstrated that the inclusion of CuO NPs was an effective strategy for enhancing the performance of new lead-free solder alloys, offering improved mechanical, thermal, and electrical properties.