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<p>Diamond/Cu composite is a promising thermal management material. Suitable coefficient of thermal expansion (CTE) of the diamond/Cu composite is important to the practical applications. Herein, we deposit a uniform 75&#xa0;nm-thick Zr coating onto diamond particles with a particle size of 272&#xa0;µm using magnetron sputtering, and then prepare Zr-diamond/Cu composites using gas pressure infiltration. The metallic Zr coating transforms into the ZrC interlayer between the Cu matrix and the diamond reinforcement in the diamond/Cu composite. A chemical bonding is formed at the ZrC/diamond interface, relieving the significant CTE mismatch between Cu and diamond. The CTE of diamond/Cu composite is remarkably decreased from 13.9 to 5.5 × 10<sup>−6</sup>/K after introducing the ZrC interlayer, which is attributed to a combination of strong interfacial bonding achieved through the ZrC interlayer and high diamond volume fraction (66%). The CTE values of the Zr-diamond/Cu composite are almost unchanged after 100 thermal cycles, exhibiting excellent application potential. This study reveals that the gas pressure infiltration coupled with magnetron sputtering is a promising method to prepare diamond/Cu composite with suitable CTE.</p>

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Thermal Expansion of Zr-Diamond/Cu Composite Prepared by Gas Pressure Infiltration

  • 期刊论文

  • 发表日期：

    2025年4月21日

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  • Yongjian Zhang,
  • Jinpeng Hao,
  • Luhua Wang,
  • Ning Li,
  • Xitao Wang,
  • Hailong Zhang

摘要

Diamond/Cu composite is a promising thermal management material. Suitable coefficient of thermal expansion (CTE) of the diamond/Cu composite is important to the practical applications. Herein, we deposit a uniform 75 nm-thick Zr coating onto diamond particles with a particle size of 272 µm using magnetron sputtering, and then prepare Zr-diamond/Cu composites using gas pressure infiltration. The metallic Zr coating transforms into the ZrC interlayer between the Cu matrix and the diamond reinforcement in the diamond/Cu composite. A chemical bonding is formed at the ZrC/diamond interface, relieving the significant CTE mismatch between Cu and diamond. The CTE of diamond/Cu composite is remarkably decreased from 13.9 to 5.5 × 10−6/K after introducing the ZrC interlayer, which is attributed to a combination of strong interfacial bonding achieved through the ZrC interlayer and high diamond volume fraction (66%). The CTE values of the Zr-diamond/Cu composite are almost unchanged after 100 thermal cycles, exhibiting excellent application potential. This study reveals that the gas pressure infiltration coupled with magnetron sputtering is a promising method to prepare diamond/Cu composite with suitable CTE.