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<p>The objective of this study was to examine the variations in flow stress and microstructure of the Cu-3.08Be alloy at the temperature ranging from 680 to 830&#xa0;°C within the strain rate range of 0.01-10&#xa0;s<sup>−1</sup>. The Arrhenius constitutive model and dynamic materials model (DMM) were established, and the 3D hot processing map and optimal processing parameters were obtained. It was observed that higher strain rates led to elevated levels of flow stress. The optimal processing temperature range for the alloy was determined to be between 780 and 820&#xa0;°C, with a strain rate of 0.01-0.1&#xa0;s<sup>−1</sup>, and an activation energy <i>Q</i> value of 281.33 KJ/mol. The evolution of dislocations, sub-grains, and dynamic recrystallization (DRX) grains was analyzed using Electron Backscatter Diffraction (EBSD) and Transmission Electron Microscopy (TEM) techniques. Initially, as the strain rate increased, a significant number of dislocations entangled around the secondary phase particles, resulting in pronounced particle-stimulated nucleation (PSN) effects characterized by an increase in recrystallized volume fraction while dislocation density decreased; additionally, low-angle grain boundaries transformed into high-angle grain boundaries. In the α (Cu), recrystallization driven primarily by the precipitation-stimulated nucleation effect (PSN) is the dominant softening mechanism, complemented by continuous dynamic recrystallization (CDRX) induced by progressive sub-grain rotation. Within the β phase, CDRX remains as the primary softening mechanism.</p>

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Softening Mechanism of Cu-3.08Be Alloy Under Hot Compression

  • 期刊论文

  • 发表日期：

    2025年3月13日

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  • Zhiya Zhao,
  • Daibo Zhu,
  • Qian Hou,
  • Zhu Wan,
  • Wenming Zhu,
  • Hailin Liu,
  • Xinyan Liu

摘要

The objective of this study was to examine the variations in flow stress and microstructure of the Cu-3.08Be alloy at the temperature ranging from 680 to 830 °C within the strain rate range of 0.01-10 s−1. The Arrhenius constitutive model and dynamic materials model (DMM) were established, and the 3D hot processing map and optimal processing parameters were obtained. It was observed that higher strain rates led to elevated levels of flow stress. The optimal processing temperature range for the alloy was determined to be between 780 and 820 °C, with a strain rate of 0.01-0.1 s−1, and an activation energy Q value of 281.33 KJ/mol. The evolution of dislocations, sub-grains, and dynamic recrystallization (DRX) grains was analyzed using Electron Backscatter Diffraction (EBSD) and Transmission Electron Microscopy (TEM) techniques. Initially, as the strain rate increased, a significant number of dislocations entangled around the secondary phase particles, resulting in pronounced particle-stimulated nucleation (PSN) effects characterized by an increase in recrystallized volume fraction while dislocation density decreased; additionally, low-angle grain boundaries transformed into high-angle grain boundaries. In the α (Cu), recrystallization driven primarily by the precipitation-stimulated nucleation effect (PSN) is the dominant softening mechanism, complemented by continuous dynamic recrystallization (CDRX) induced by progressive sub-grain rotation. Within the β phase, CDRX remains as the primary softening mechanism.