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<p>This paper explores the effect of graphene nanoplatelets (GNPs) content on the uniaxial compressive behavior and thermal conductivity of graphene reinforced copper composite foams. Surfactant-assisted electrostatic self-assembly was adopted to disperse GNPs within copper matrix, while space-holder route was used to synthesize pure copper and graphene reinforced copper composite foams of ~ 62% porosity. With incorporation of GNPs, the compression plateau stress and energy absorption capacity of foams initially increased followed by a drop in these values with increasing GNPs content. The presence of GNPs in copper matrix strengthens it through dispersion and dislocation strengthening mechanisms, while thermal conductivity of these composite foams is improved due to the formation of GNPs networks. The highest increment in compressive response was observed after incorporation of 0.25 wt.% GNPs, whereas addition of 0.50 wt.% GNPs caused the highest jump (~13%) in the thermal conductivity of graphene reinforced copper composite foams over pure copper foams. The best combination of compressive properties and thermal performance was observed in Cu-0.25 wt.% GNPs composite foam (~62% porous) which possesses plateau stress of 42 ± 2.7&#xa0;MPa, energy absorption capacity of 21 ± 1.0&#xa0;MJ/m<sup>3</sup>, and thermal conductivity of 96.06 ± 0.07 W/m K.</p>

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Effect of Graphene Nanoplatelet Reinforcement on the Compressive and Thermal Performance of Copper Composite Foams Fabricated using Space-Holder Technique

  • 期刊论文

  • 发表日期：

    2025年3月3日

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  • Nikhil Rajendra Gorhe,
  • Sriram Sathaiah,
  • Lalit Mohan Joshi,
  • Tilak Chandra Joshi,
  • Dehi Pada Mondal

摘要

This paper explores the effect of graphene nanoplatelets (GNPs) content on the uniaxial compressive behavior and thermal conductivity of graphene reinforced copper composite foams. Surfactant-assisted electrostatic self-assembly was adopted to disperse GNPs within copper matrix, while space-holder route was used to synthesize pure copper and graphene reinforced copper composite foams of ~ 62% porosity. With incorporation of GNPs, the compression plateau stress and energy absorption capacity of foams initially increased followed by a drop in these values with increasing GNPs content. The presence of GNPs in copper matrix strengthens it through dispersion and dislocation strengthening mechanisms, while thermal conductivity of these composite foams is improved due to the formation of GNPs networks. The highest increment in compressive response was observed after incorporation of 0.25 wt.% GNPs, whereas addition of 0.50 wt.% GNPs caused the highest jump (~13%) in the thermal conductivity of graphene reinforced copper composite foams over pure copper foams. The best combination of compressive properties and thermal performance was observed in Cu-0.25 wt.% GNPs composite foam (~62% porous) which possesses plateau stress of 42 ± 2.7 MPa, energy absorption capacity of 21 ± 1.0 MJ/m3, and thermal conductivity of 96.06 ± 0.07 W/m K.