Scholarlink

<p>With the rapid development of microelectronic devices towards higher frequency, high speed, miniaturization, and high integration, there is a growing need for interlayer dielectric materials with a low dielectric constant (<i>ε</i>) and coefficient of thermal expansion (CTE). Traditional aromatic polyimides with <i>ε</i> ranging from 3.2 to 3.6 and CTEs exceeding 60&#xa0;ppm/K cannot meet the requirements of modern 5G communications, integrated circuits, and advanced packaging. In this paper, a hydroxyl-containing polyimide was synthesized by thermal polycondensation of 2,2-bis(4-hydroxy-3-aminophenyl) propane (BAP), 4,4′-diaminodiphenyl ether (ODA) and 1,2,4,5-benzotetraacetic anhydride (PMDA) with aminopropyl heptyl-terminated poly(dicyclohexylsiloxane) (NH<sub>2</sub>-POSS) as the end-capping agent. Subsequently, thermal rearrangement reactions between hydroxyl groups and imine rings at high temperatures were conducted to prepare a polyimide with low ε and CTE and an oxazole ring structure in the main chain (Re-xBAP-PI). The thermal rearrangement reactions reduced the CTE value of Re-xBAP-PI to 19.6–25.4&#xa0;ppm/K, and the introduction of NH<sub>2</sub>-POSS effectively lowered the dielectric constant of the Re-xBAP-PI samples. The Re-2BAP-PI samples demonstrated a dielectric constant of 2.79 at 200&#xa0;kHz, a CTE of 26.3&#xa0;ppm/K, a breakdown strength of 177.41&#xa0;kV/mm, and a water absorption rate of 2.47%. Given these exceptional properties, the polyimide materials synthesized through this method are expected to provide novel interlayer dielectric materials with low ε and CTE.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Low Dielectric Constant and Low Thermal Expansion Coefficient Polyimide with Oxazole Ring Structure in the Main Chain

  • 期刊论文

  • 发表日期：

    2026年5月21日

查看全文
  • Shangjin Xu,
  • Jialin Chen,
  • Fengmei Ren,
  • Haihong Ma,
  • Weibing Xu,
  • Zhengfa Zhou

摘要

With the rapid development of microelectronic devices towards higher frequency, high speed, miniaturization, and high integration, there is a growing need for interlayer dielectric materials with a low dielectric constant (ε) and coefficient of thermal expansion (CTE). Traditional aromatic polyimides with ε ranging from 3.2 to 3.6 and CTEs exceeding 60 ppm/K cannot meet the requirements of modern 5G communications, integrated circuits, and advanced packaging. In this paper, a hydroxyl-containing polyimide was synthesized by thermal polycondensation of 2,2-bis(4-hydroxy-3-aminophenyl) propane (BAP), 4,4′-diaminodiphenyl ether (ODA) and 1,2,4,5-benzotetraacetic anhydride (PMDA) with aminopropyl heptyl-terminated poly(dicyclohexylsiloxane) (NH2-POSS) as the end-capping agent. Subsequently, thermal rearrangement reactions between hydroxyl groups and imine rings at high temperatures were conducted to prepare a polyimide with low ε and CTE and an oxazole ring structure in the main chain (Re-xBAP-PI). The thermal rearrangement reactions reduced the CTE value of Re-xBAP-PI to 19.6–25.4 ppm/K, and the introduction of NH2-POSS effectively lowered the dielectric constant of the Re-xBAP-PI samples. The Re-2BAP-PI samples demonstrated a dielectric constant of 2.79 at 200 kHz, a CTE of 26.3 ppm/K, a breakdown strength of 177.41 kV/mm, and a water absorption rate of 2.47%. Given these exceptional properties, the polyimide materials synthesized through this method are expected to provide novel interlayer dielectric materials with low ε and CTE.