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<p>This article provides a thorough review of superconducting metamaterials, focusing on their theoretical foundations, fabrication methods, and areas of application. Although numerous studies have examined particular elements of superconducting devices or metamaterials independently, a comprehensive synthesis is absent. This paper provides a critical survey of key models, including effective-medium approaches, nonlinear circuit formulations, and quantum descriptions of SQUID-based (superconducting quantum interference device) meta-atoms, while evaluating their connections to experimental implementations. This study analyses advancements in fabrication techniques, including thin-film lithography and three-dimensional integration, while identifying scalability challenges and potential solutions. Applications are evaluated in the domains of quantum information, sensing, cloaking, and wireless power transfer. We conclude by identifying existing challenges and presenting a framework for future advancements. This review serves as a reference for established researchers and an accessible introduction for newcomers to the field of superconducting metamaterials.</p>

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Review on Superconducting Metamaterials: Modeling, Fabrication, and Applications in Quantum and RF Systems

  • 期刊论文

  • 发表日期：

    2026年1月22日

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  • Boris Joel Kenne Telezing,
  • Jinxing Liu

摘要

This article provides a thorough review of superconducting metamaterials, focusing on their theoretical foundations, fabrication methods, and areas of application. Although numerous studies have examined particular elements of superconducting devices or metamaterials independently, a comprehensive synthesis is absent. This paper provides a critical survey of key models, including effective-medium approaches, nonlinear circuit formulations, and quantum descriptions of SQUID-based (superconducting quantum interference device) meta-atoms, while evaluating their connections to experimental implementations. This study analyses advancements in fabrication techniques, including thin-film lithography and three-dimensional integration, while identifying scalability challenges and potential solutions. Applications are evaluated in the domains of quantum information, sensing, cloaking, and wireless power transfer. We conclude by identifying existing challenges and presenting a framework for future advancements. This review serves as a reference for established researchers and an accessible introduction for newcomers to the field of superconducting metamaterials.