Scholarlink

<p>This study conducted a systematic investigation on the shear strength and microstructural evolution of Cu/Sn-58Bi/microporous-Cu/Sn-58Bi/Cu composite solder joints subjected to varied bonding parameters and subsequent isothermal aging at 120°C for durations extending to 60&#xa0;days. The bonding process was executed using a magnetically agitated reflow platform. The joint mechanical properties were evaluated through shear strength testing and microstructural evolution observed by scanning electron microscopy (SEM) and energy-dispersive x-ray spectroscopy (EDS). The results demonstrate that the shear strength of the composite joints peaked at 73&#xa0;MPa under a bonding temperature of 250°C and a bonding time of 30&#xa0;s. However, extending the bonding time to 90&#xa0;s at 250°C induced excessive coarsening of the brittle Bi phase and void formation, resulting in diminished shear strength of 66.7&#xa0;MPa. During thermal aging, the shear strength exhibited an initial decrease followed by a subsequent recovery. This recovery is primarily associated with the refinement of Bi-rich phases and phase segregation, which lead to the redistribution of internal stress and the temporary stabilization of the microstructure. These observations substantiate the feasibility of fabricating high-performance joints under ambient conditions. These findings provide critical engineering insights for optimizing processing parameters and controlling microstructure to enhance the reliability of high-temperature packaging in third-generation semiconductor devices and power electronics.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Cu/Sn-58Bi/Microporous-Cu Composite Joint Formation via Capillary-Driven Transient Liquid-Phase Bonding Under Air Atmosphere

  • 期刊论文

  • 发表日期：

    2025年11月25日

查看全文
  • Bifu Xiong,
  • Cui Luo,
  • Xingyu Li,
  • Liangyin Hu,
  • Haobo Dong,
  • Siliang He,
  • Zhishen Liang,
  • Ni Zhang,
  • Hongbo Qin,
  • Hiroshi Nishikawa

摘要

This study conducted a systematic investigation on the shear strength and microstructural evolution of Cu/Sn-58Bi/microporous-Cu/Sn-58Bi/Cu composite solder joints subjected to varied bonding parameters and subsequent isothermal aging at 120°C for durations extending to 60 days. The bonding process was executed using a magnetically agitated reflow platform. The joint mechanical properties were evaluated through shear strength testing and microstructural evolution observed by scanning electron microscopy (SEM) and energy-dispersive x-ray spectroscopy (EDS). The results demonstrate that the shear strength of the composite joints peaked at 73 MPa under a bonding temperature of 250°C and a bonding time of 30 s. However, extending the bonding time to 90 s at 250°C induced excessive coarsening of the brittle Bi phase and void formation, resulting in diminished shear strength of 66.7 MPa. During thermal aging, the shear strength exhibited an initial decrease followed by a subsequent recovery. This recovery is primarily associated with the refinement of Bi-rich phases and phase segregation, which lead to the redistribution of internal stress and the temporary stabilization of the microstructure. These observations substantiate the feasibility of fabricating high-performance joints under ambient conditions. These findings provide critical engineering insights for optimizing processing parameters and controlling microstructure to enhance the reliability of high-temperature packaging in third-generation semiconductor devices and power electronics.