<p>Direct ink writing (DIW) is an additive manufacturing technique that enables the deposition of conductive liquid materials for electronic applications. However, achieving continuous micron-scale tracks with consistent track width and electrical properties poses a critical challenge essential for the reliability of electrical circuits. This study examines the deposition of copper-based conductive ink utilizing an in-house-developed DIW setup. The objective is to optimize process parameters to enhance track width (TW) accuracy and sheet resistance (SR). The process parameters, including stand-off distance, extrusion multiplier, nozzle diameter, and print speed, were investigated for their effect on tracks and electrical performance using response surface methodology (RSM). Multi-objective optimization was utilized to define quantitative relationships between process variables and performance metrics. The findings indicate that linear, quadratic, and interaction terms significantly affect TW and SR. The predicted TW and SR values derived from Pareto-optimized parameters strongly correlate with experimental results, indicating a high level of predictive accuracy. A functional circuit was fabricated as a case study to demonstrate the practical applicability of the deposited tracks, integrating various electronic components for DC voltage regulation. Results highlight the significance of optimizing process parameters in producing high-quality conductive tracks using DIW for advanced electronic applications.</p>