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<p>Use of sintered nanosilver as a die-attach material in electronic assemblies has now proven effective and particularly suitable for high-power applications where thermal loading generates critical operating conditions. In this study, the fundamental material behaviour of the sintered silver joint is first described based on a modified version of the Gurson model. The model, accounting for the porosity-dependent nonlinear properties of the joint, is implemented in the finite element code Abaqus, giving the ability to carry out physics-based accurate simulations of the active assembly. The joint design parameters, which play a key role on the general mechanical reliability of the system, are then investigated by employing a design of experiments approach coupled with finite elements simulations. It is found that the joint thickness has the greatest impact on the dissipated cyclic energy of the joint, with a larger thickness being preferable to reduce energy dissipation. In contrast, the joint initial porosity most significantly affects equivalent stress in the material. For comparison purposes, a standard tin-based solder used as a die attach material in the electronic assembly is also investigated following the same methodology at the end of the study.</p>

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Design of Experiments-Based Numerical Analysis of Moderately Low to High Porous Sintered Nano-Silver Joints Under Thermal Shocks

  • 期刊论文

  • 发表日期：

    2025年9月1日

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  • Lahouari Benabou,
  • Manli Chen,
  • Laurent Vivet,
  • Mohand Ould Ouali

摘要

Use of sintered nanosilver as a die-attach material in electronic assemblies has now proven effective and particularly suitable for high-power applications where thermal loading generates critical operating conditions. In this study, the fundamental material behaviour of the sintered silver joint is first described based on a modified version of the Gurson model. The model, accounting for the porosity-dependent nonlinear properties of the joint, is implemented in the finite element code Abaqus, giving the ability to carry out physics-based accurate simulations of the active assembly. The joint design parameters, which play a key role on the general mechanical reliability of the system, are then investigated by employing a design of experiments approach coupled with finite elements simulations. It is found that the joint thickness has the greatest impact on the dissipated cyclic energy of the joint, with a larger thickness being preferable to reduce energy dissipation. In contrast, the joint initial porosity most significantly affects equivalent stress in the material. For comparison purposes, a standard tin-based solder used as a die attach material in the electronic assembly is also investigated following the same methodology at the end of the study.