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<p>This study investigates the electrochemical migration (ECM) failure behavior of surface-mount resistors under various bias voltages, with a NaCl concentration of 500&#xa0;ppm. At 2&#xa0;V, no dendrites were observed, but significant anodic corrosion and white corrosion product accumulation occurred. At 3–4&#xa0;V, complete silver-gray dendrites formed with some white corrosion products, while a bias of 5–10&#xa0;V led to incomplete migration dendrites with reduced white corrosion products. At 3&#xa0;V, dendrites caused sustained overcurrent even after electrolyte evaporation. At 5–7&#xa0;V, multiple dendrites resulted in short circuits, causing a current density surge exceeding 45%, while at 8–10&#xa0;V, dendrite growth was rapid but incomplete. Microscopic analysis showed that dendrites grew thicker at 6–7&#xa0;V and thinner at 8–10&#xa0;V. Energy dispersive spectrometry (EDS) revealed that the dendrites primarily consist of Sn and its oxides, with localized Ni enrichment but no Ag migration detected, confirming Sn dissolution and migration as the primary ECM mechanism.</p>

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Study of the Effect of Bias Voltage on the Electrochemical Migration Failure of Surface-Mount Resistor

  • 期刊论文

  • 发表日期：

    2025年8月25日

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  • Luntao Wang,
  • Zixue Jiang,
  • Yao Tan,
  • Jialiang Song,
  • Hao Zhang,
  • Xianqin Zhu,
  • Heqian Wang,
  • Chaofang Dong,
  • Kui Xiao

摘要

This study investigates the electrochemical migration (ECM) failure behavior of surface-mount resistors under various bias voltages, with a NaCl concentration of 500 ppm. At 2 V, no dendrites were observed, but significant anodic corrosion and white corrosion product accumulation occurred. At 3–4 V, complete silver-gray dendrites formed with some white corrosion products, while a bias of 5–10 V led to incomplete migration dendrites with reduced white corrosion products. At 3 V, dendrites caused sustained overcurrent even after electrolyte evaporation. At 5–7 V, multiple dendrites resulted in short circuits, causing a current density surge exceeding 45%, while at 8–10 V, dendrite growth was rapid but incomplete. Microscopic analysis showed that dendrites grew thicker at 6–7 V and thinner at 8–10 V. Energy dispersive spectrometry (EDS) revealed that the dendrites primarily consist of Sn and its oxides, with localized Ni enrichment but no Ag migration detected, confirming Sn dissolution and migration as the primary ECM mechanism.