A Promising Passivation Strategy Using Polyimide for Enhancing the Performance of Metal Oxide Thin-Film Transistors
摘要
The excellent chemical stability and hydrophobicity of polyimide (PI) make it an attractive candidate for high-performance flexible electronic applications. However, detailed studies of PI-passivated metal oxide thin-film transistors (MOTFTs) are still lacking. In this work, we fabricated indium oxide (In2O3) TFTs employing a PI passivation layer (PPL), which resulted in low damage and good dielectric quality. A comprehensive comparison of the electrical performance was conducted in terms of the saturation mobility, on/off current ratio (Ion/Ioff), threshold voltage (Vth), subthreshold swing (SS), and interface trap density (Nit) of the In2O3 TFTs passivated with PI of different thicknesses. In addition, the PPL was found to significantly suppress the adsorption of surrounding moisture and oxygen from the environment owing to its most chemically robust carbon-fluorine bond. The TFT with PPL exhibited relatively good electrical performance (μsat = 2.418 cm2/Vs) compared with that (μsat = 1.2 cm2/Vs) of the TFT without the PPL. The passivated device exhibited good stability (ΔVth: −0.95 V), while the TFTs without the PPL showed a −8.0 V ΔVth shift. The results indicate that PI-passivated In2O3 TFT demonstrates a drastically reduced threshold voltage and highest stability. Consequently, PI film is a promising organic material for various emerging electronic devices.
Graphical abstract