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<p>Fabrics have the advantages of air permeability, skin-friendliness, and washability, making them an attractive substrate for wearable signal-processing circuits. However, fabricating high-performance circuits on the porous and uneven fabric surface remain a challenge. Here, we propose a fabric circuit with high conductivity, fatigue resistance, high resolution, and washability. Fabric circuits are achieved by sputtering compact and continuous conductive copper paths onto the fabric with a patterned polyimide film. The patterned polyimide film on the fabric facilitates the sputtering deposition of copper, while maintaining the air permeability of the fabric. A protective Parylene film on the conductive copper path increases the bending fatigue and washability of the fabric circuit. Highly conductive paths with a 0.4&#xa0;mm linewidth can be fabricated. The sheet resistance of the conductive path was 0.412&#xa0;±&#xa0;0.09&#xa0;Ω/sq, the resistance change of the conductive path was about 55.72% after 1000 bending cycles, and the resistance change was about 47.04% after 10 washing tests. This study provides a way to fabricate highly conductive, fatigue-resistant, washable, and high-resolution fabric circuit, promoting the development of portable and continuous electrophysiological signal monitoring.</p>

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A Process for Preparing Fabric Circuits with High Conductivity and Resolution

  • 期刊论文

  • 发表日期：

    2025年5月5日

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  • Yuanfen Chen,
  • Ke Xu,
  • Shuoyi Xu,
  • Yao Chen,
  • Lin Li,
  • Wang Tang

摘要

Fabrics have the advantages of air permeability, skin-friendliness, and washability, making them an attractive substrate for wearable signal-processing circuits. However, fabricating high-performance circuits on the porous and uneven fabric surface remain a challenge. Here, we propose a fabric circuit with high conductivity, fatigue resistance, high resolution, and washability. Fabric circuits are achieved by sputtering compact and continuous conductive copper paths onto the fabric with a patterned polyimide film. The patterned polyimide film on the fabric facilitates the sputtering deposition of copper, while maintaining the air permeability of the fabric. A protective Parylene film on the conductive copper path increases the bending fatigue and washability of the fabric circuit. Highly conductive paths with a 0.4 mm linewidth can be fabricated. The sheet resistance of the conductive path was 0.412 ± 0.09 Ω/sq, the resistance change of the conductive path was about 55.72% after 1000 bending cycles, and the resistance change was about 47.04% after 10 washing tests. This study provides a way to fabricate highly conductive, fatigue-resistant, washable, and high-resolution fabric circuit, promoting the development of portable and continuous electrophysiological signal monitoring.