Analysis of Threading Edge Dislocation Low-Angle Grain Boundary Network Distributions in 4H-SiC Wafers Through Synchrotron X-ray Topography and Ray-Tracing Simulation
摘要
Analysis of a distinct threading edge dislocation (TED) low-angle grain boundary (LAGB) network is carried out on physical vapor transport (PVT)-grown off-axis 4H-SiC wafers through synchrotron x-ray topography in conjunction with ray-tracing simulation. The frequently observed white contrast main TED LAGB network distributed approximately along the