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<p>Sn37Pb eutectic solder alloy has been widely used in deep-space electronics. However, the variation in the mechanical properties of Sn-rich and Pb-rich phases with decreasing temperature will cause interactions between the constituent phases, further leading to the variation in the fracture mechanism of the Sn37Pb solder alloy. In this work, the mechanical properties of a Sn37Pb solder alloy in a temperature range from liquid nitrogen temperature (LNT, 77&#xa0;K) to room temperature (RT, 293&#xa0;K) were obtained through uniaxial tensile tests. Sn-rich and Pb-rich phases exhibited a difference in mechanical properties, especially at LNT. The deformation and fracture behaviors of the Sn37Pb solder alloy were analyzed, considering the interfacial endogenous stress due to the coefficient of thermal expansion (CTE) mismatch and strain incompatibility between the constituent phases. The calculated value of endogenous stress at the Sn-rich phase/Pb-rich phase interface was 23&#xa0;MPa. Finite element simulations of representative volume elements (RVEs) with different phase volume fractions of the Sn-rich phase in the Sn37Pb solder alloy were conducted based on realistic microstructures. The constitutive parameters of the constituent phases were extracted by an inverse approach using nanoindentation tests. The variation in stress distribution in the two constituent phases was analyzed to investigate the location of crack initiation and crack propagation at cryogenic temperatures.</p>

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Effects of Interaction Between Sn-Rich and Pb-Rich Phases on the Mechanical Properties of Sn-Pb Eutectic Solder Alloy at Cryogenic Temperature

  • 期刊论文

  • 发表日期：

    2025年1月3日

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  • Qi An,
  • Minghua Zhang,
  • Ningning Wang,
  • Jingming Fei

摘要

Sn37Pb eutectic solder alloy has been widely used in deep-space electronics. However, the variation in the mechanical properties of Sn-rich and Pb-rich phases with decreasing temperature will cause interactions between the constituent phases, further leading to the variation in the fracture mechanism of the Sn37Pb solder alloy. In this work, the mechanical properties of a Sn37Pb solder alloy in a temperature range from liquid nitrogen temperature (LNT, 77 K) to room temperature (RT, 293 K) were obtained through uniaxial tensile tests. Sn-rich and Pb-rich phases exhibited a difference in mechanical properties, especially at LNT. The deformation and fracture behaviors of the Sn37Pb solder alloy were analyzed, considering the interfacial endogenous stress due to the coefficient of thermal expansion (CTE) mismatch and strain incompatibility between the constituent phases. The calculated value of endogenous stress at the Sn-rich phase/Pb-rich phase interface was 23 MPa. Finite element simulations of representative volume elements (RVEs) with different phase volume fractions of the Sn-rich phase in the Sn37Pb solder alloy were conducted based on realistic microstructures. The constitutive parameters of the constituent phases were extracted by an inverse approach using nanoindentation tests. The variation in stress distribution in the two constituent phases was analyzed to investigate the location of crack initiation and crack propagation at cryogenic temperatures.