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<p>Gallium-based liquid metals exhibit excellent thermal conductivity but suffer from severe corrosivity toward copper, which limits their application as thermal interface materials (TIMs) in high-power electronic devices. To address this challenge, graphene (Gr) and graphene oxide (GO) coatings were employed to protect copper substrates against gallium-induced corrosion. The interfacial interactions were analyzed using first-principles calculations, and the protective performance was systematically evaluated through surface characterization and thermal transport testing. The simulations indicated that both graphene and GO interact with Cu, Ga, and Ga<sub>2</sub>O<sub>3</sub><i>via</i> weak physical adsorption without chemical reactions. The presence of hydroxyl and epoxy functional groups in GO enhanced its adhesion with copper and gallium, resulting in stronger interface stability. Experimental observations confirmed that multilayer graphene reduced intermetallic compound (IMC) formation, while GO coating provided complete corrosion inhibition under long-term exposure at 125&#xa0;°C, except for the lowest-concentration sample. The Cu@1.5GO sample exhibited the highest thermal conductivity (249.5 W&#xa0;m<sup>−1</sup>&#xa0;K<sup>−1</sup>) and a low interfacial thermal resistance (0.1260 mm<sup>2</sup>&#xa0;K&#xa0;W<sup>−1</sup>), maintaining structural integrity during repeated thermal cycling. These results demonstrate that GO films serve as effective anticorrosion and thermally conductive barriers, offering a viable approach for the integration of gallium-based liquid metals in advanced thermal management systems.</p>

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Graphene and Graphene Oxide Protective Layers on Copper Substrates: Interfacial Mechanisms and Effectiveness in Suppressing Gallium Corrosion

  • 期刊论文

  • 发表日期：

    2026年5月23日

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  • Xiaoqi Yi,
  • Yuhui Zhang,
  • Guangyin Liu,
  • Jun Shen

摘要

Gallium-based liquid metals exhibit excellent thermal conductivity but suffer from severe corrosivity toward copper, which limits their application as thermal interface materials (TIMs) in high-power electronic devices. To address this challenge, graphene (Gr) and graphene oxide (GO) coatings were employed to protect copper substrates against gallium-induced corrosion. The interfacial interactions were analyzed using first-principles calculations, and the protective performance was systematically evaluated through surface characterization and thermal transport testing. The simulations indicated that both graphene and GO interact with Cu, Ga, and Ga2O3via weak physical adsorption without chemical reactions. The presence of hydroxyl and epoxy functional groups in GO enhanced its adhesion with copper and gallium, resulting in stronger interface stability. Experimental observations confirmed that multilayer graphene reduced intermetallic compound (IMC) formation, while GO coating provided complete corrosion inhibition under long-term exposure at 125 °C, except for the lowest-concentration sample. The Cu@1.5GO sample exhibited the highest thermal conductivity (249.5 W m−1 K−1) and a low interfacial thermal resistance (0.1260 mm2 K W−1), maintaining structural integrity during repeated thermal cycling. These results demonstrate that GO films serve as effective anticorrosion and thermally conductive barriers, offering a viable approach for the integration of gallium-based liquid metals in advanced thermal management systems.