<p>To address the limitations of conventional fusion welding, the development of high-speed and high-strength solid-state joining technologies for dissimilar materials is essential. In this study, cold spot forge welding was applied to the lap joining of 1‑mm‑thick SUS304 stainless steel and A6061‑T6 aluminum alloy sheets with a spot diameter of 8 mm. The effects of the bonding temperature and the reduction ratio <i>R</i> on the joint strength and reaction layer (RL) formation were investigated at the bonding temperatures of 538&#xa0;K to 693&#xa0;K (265&#xa0;°C to 420&#xa0;°C) and the reduction ratios of 1.02 to 3.98. Tensile‑shear testing was conducted, and the interfacial reaction behavior was examined using electron probe microanalysis, electron backscatter diffraction, transmission electron microscopy, and related techniques. The diffusion-barrier effect of the oxide film decreased with increasing <i>R</i>, enabling the control of the RL thickness through the combined influence of <i>R</i> and the bonding temperature. The optimal processing conditions were identified as 663&#xa0;K (390&#xa0;°C) and <i>R</i> = 2.6, under which the RL was 10 to 30&#xa0;nm thick and was effectively free of intermetallic compounds (IMCs). Future prospects for establishing predictive formulas for joint quality based on the relationship between the RL thickness and tensile strength are also presented. These findings advance solid-state joining technology by demonstrating a high-throughput method capable of overcoming IMC-related brittleness.</p>

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Fe/Al Dissimilar Cold Spot Forge Welding: Effects of Bonding Temperature and Reduction Ratio on Joint Strength and Interfacial Reactions

  • Hideki Yamagishi

摘要

To address the limitations of conventional fusion welding, the development of high-speed and high-strength solid-state joining technologies for dissimilar materials is essential. In this study, cold spot forge welding was applied to the lap joining of 1‑mm‑thick SUS304 stainless steel and A6061‑T6 aluminum alloy sheets with a spot diameter of 8 mm. The effects of the bonding temperature and the reduction ratio R on the joint strength and reaction layer (RL) formation were investigated at the bonding temperatures of 538 K to 693 K (265 °C to 420 °C) and the reduction ratios of 1.02 to 3.98. Tensile‑shear testing was conducted, and the interfacial reaction behavior was examined using electron probe microanalysis, electron backscatter diffraction, transmission electron microscopy, and related techniques. The diffusion-barrier effect of the oxide film decreased with increasing R, enabling the control of the RL thickness through the combined influence of R and the bonding temperature. The optimal processing conditions were identified as 663 K (390 °C) and R = 2.6, under which the RL was 10 to 30 nm thick and was effectively free of intermetallic compounds (IMCs). Future prospects for establishing predictive formulas for joint quality based on the relationship between the RL thickness and tensile strength are also presented. These findings advance solid-state joining technology by demonstrating a high-throughput method capable of overcoming IMC-related brittleness.