<p>The increasing demand for efficient cooling in modern electronic/electrical devices necessitates innovative thermal management solutions. This study introduces a novel mini-channel bubble pump, featuring an asymmetrically heated porous surface, specifically designed to address the challenges of high-performance immersion cooling. By leveraging the buoyancy of vapor bubbles generated through boiling, this self-circulating system eliminates the need for external power input, offering a highly integrated and compact cooling solution. This study experimentally investigates the impact of incorporating various copper foams as the wick structures on the heating surface to enhance boiling heat transfer and overall bubble pump performance. We demonstrate that the addition of copper foam significantly alters the operational heat flux range, notably decreasing both minimal and maximal heat fluxes. For instance, with a channel size of 3×3 mm² and an immersion depth of 120 mm, the minimum heat flux required for normal operation could be nearly halved (from 0.96 to 0.47 W/cm²), indicating a significant improvement in startup performance. Furthermore, the wick structure facilitates a lower and more uniform distribution of wall temperature along the channels, directly contributing to enhanced thermal management and extended device longevity. While the wick improves nucleation and temperature uniformity, its impact on liquid pumping ability under high heat flux conditions requires further microscopic investigation. This work provides crucial insights into the asymmetrically heated surface design in compact system and the integration of copper foam in the bubble pump, paving the way for next-generation, energy-efficient immersion cooling technologies.</p>