<p>As an emerging cooling solution, the technology of using liquid metal as a cooling medium for chips has been the subject of many classic studies. This considerable critical attention stems from the practicality and broad applicability of liquid metal in addressing the thermal management challenges posed by 3D ICs (Three-Dimensional Integrated Circuits). Recognized for its superior heat transfer properties, liquid metal shows significant potential to replace traditional heat transfer fluids. Compared to conventional chip cooling methods, liquid metal-based technologies offer higher heat dissipation efficiency and improved performance. This paper analyses research on liquid metal chip cooling, categorizing the findings into five key areas: cooling medium selection, channel design, drive pump analysis, system performance evaluation methods, and the co-design of liquid metal microfluidic chip heat dissipation systems. The comprehensive review is expected to provide a theoretical reference and technical guidance for liquid metal-based chip cooling technologies.</p>