<p>The low-melting glass of Bi₂O₃-B₂O₃-SiO₂ (BiBSi) system was used for the first time for laser sealing of vacuum glazing. Under the condition of constant boron content, how the structure and properties vary with Bi/Si ratio in low-melting glass was investigated. In addition, the relationships between laser power, low-melting glass solder with different Bi/Si ratios and laser sealing shear strength were revealed. The results show that a decrease in the Bi/Si ratio can cause a contraction of the glass network of the low-melting glass, leading to an increase of its characteristic temperature and a decrease of its coefficient of thermal expansion. During laser sealing, the copper ions in the low-melting glass play an endothermic role. A change in the Bi/Si ratio will affect the valence state transition of the copper ions in the low-melting glass. The absorbance of the low-melting glass does not follow the expected correlation with the Bi/Si ratio, but shows a linear correlation with the content of divalent copper ions. The greater the concentration of divalent copper ions, the greater the absorbance of the low-melting glass, and the lower the laser power required for laser sealing. The shear strength of the low melting glass solder after laser sealing was tested, and it was found that the maximum shear strength of Z1 glass sample was the highest up to 2.67 MPa.</p>