<p>Lithium metal is considered an ideal anode for high-energy density cathodes, but the formation of lithium dendrites can seriously affect the cycling stability of lithium metal batteries. Herein, we prepared a lithiophilic silver(Ag) and gold(Au) interface layer through a straightforward chemical plating process, resulting in the acquisition of Ag@Cu and Au@Cu electrodes. The results demonstrate that Ag@Cu exhibits a more uniform elemental distribution and smoother surface morphology. The initial lithium deposition overpotentials for Ag@Cu and Au@Cu are 38 mV and 102 mV, respectively. Due to differences in electrochemical polarization and reaction kinetics, the deposition mechanisms of lithium ions on Ag@Cu and Au@Cu are integral deposition and regional deposition, respectively. A more rational deposition mechanism enables Ag@Cu exhibit better long cycle life and rate performance, and can effectively inhibit the growth of lithium dendrites. This work offers a viable solution and serves as a reference for constructing a lithiophilic interface layer for lithium metal anodes.</p>