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<p>In this paper, a compact terahertz (THz) on-chip metasurface antenna based on leaky-wave holographic methodology is proposed to address the demands for enhanced channel capacity and system integration in communication systems. The proposed THz antenna enables the generation of two distinct high-order Bessel beams carrying <i>l</i> = ±1 orbital angular momentum (OAM) modes across 300–308 GHz. The silicon-based microfabricated prototype demonstrates an average OAM mode purity of 0.78, while the electric-field energy maintains spatial confinement within the 7.68 mm × 7.68 mm metasurface aperture at 20.4 λ<sub>0</sub> transmission distance. The subwavelength thickness (0.16 λ<sub>0</sub>) and complementary metal-oxide-semiconductor (CMOS)-compatible architecture highlight its potential for seamless integration with terahertz integrated circuits and next-generation 6G communication systems.</p>

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Terahertz on-chip non-diffractive OAM metasurface antenna based on silicon microfabrication technology

  • 期刊论文

  • 发表日期：

    2026年4月20日

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  • Shu-Yan Zhu,
  • Yilong Cai,
  • Yunchu Li,
  • Geng-Bo Wu

摘要

In this paper, a compact terahertz (THz) on-chip metasurface antenna based on leaky-wave holographic methodology is proposed to address the demands for enhanced channel capacity and system integration in communication systems. The proposed THz antenna enables the generation of two distinct high-order Bessel beams carrying l = ±1 orbital angular momentum (OAM) modes across 300–308 GHz. The silicon-based microfabricated prototype demonstrates an average OAM mode purity of 0.78, while the electric-field energy maintains spatial confinement within the 7.68 mm × 7.68 mm metasurface aperture at 20.4 λ0 transmission distance. The subwavelength thickness (0.16 λ0) and complementary metal-oxide-semiconductor (CMOS)-compatible architecture highlight its potential for seamless integration with terahertz integrated circuits and next-generation 6G communication systems.