High ON/OFF and high FoM of fmax×BV×Lg InAlN/GaN HEMTs by using polycrystalline-AlN cap
摘要
In this paper, we demonstrate the excellent performance of InAlN/GaN high electron mobility transistors (HEMTs) for high-voltage radio frequency (RF) application. By using a composite cap layer structure of GaN cap layer and polycrystalline (PC)-AlN cap layer, the gate leakage is effectively suppressed, resulting in a 0.5-µm InAlN/GaN HEMTs achieving a high current on/off ratio (ON/OFF) of 7 × 107 as well as a record breakdown voltage (BV) of 270 V. The device yields a high peak transconductance (Gm) of 350 mS/mm and a low sub-threshold swing (SS) of 80 mV/decade while virtually free of drain induced barrier lowering (DIBL) effect (about 2.5 mV/V). Besides, the InAlN/GaN HEMTs with composite cap layer structure exhibit a current gain cut-off frequency/ maximum oscillation frequency (fT/fmax) of 22/64 GHz. To the best of our knowledge, the device has the highest figure-of-merit (FoM = fmax × BV × Lg) of 8.6 THz·V·µm compared to the InAlN/GaN HEMTs reported in the past. These results demonstrate that the design of the composite cap layer structure extends the RF InAlN/GaN HEMTs for high voltage applications.