<p>With the development of electronic devices toward higher integration and performance, the parallel operation of multiple functional modules within chip systems causes non-uniform heat source distribution and significant variations in power density. The resulting heat dissipation challenges have become a core issue in the field of thermal management. This study proposes a topology optimized heat sink based on liquid metal phase change materials. Through the optimization and rational configuration of the fin structure, effective thermal management of high heat flux heterogeneous heat sources is achieved. Comparative experiments were conducted between the optimized heat sink and a conventional plate fin structure heat sink. Results indicate that the topology optimized heat sink design extended operational duration by 122.7% and reduced maximum temperature by 15.2°C at 100 s. The study also found a significant positive correlation between the fin branching ratio and the heat flux ratio of heterogeneous heat sources. When the heat flux ratio was 2.5 (50:20), the fin branching ratio was 2.09, whereas at a heat flux ratio of 1 (50:50), the fin branching ratio was 1.1. Finally, through comparative analysis of topology optimized fin structures under different optimization strategies, fin structures concentrated on heat sinks distributed near heat sources demonstrate significant advantages in handling transient high thermal loads. Conversely, heat sinks with globally extended fin structures facilitate accelerated phase change throughout the entire phase change cycle and enhance heat absorption efficiency, achieving superior sustained thermal dissipation performance.</p>