Close contact melting for efficient thermal buffering of high heat flux electronics
摘要
Efficient thermal buffering for high heat flux electronics is a critical challenge. To tackle this issue, the study introduces a finned phase change thermal buffer (PCTB) scheme. By developing a modified apparent heat capacity method, this work investigates internal close contact melting (CCM) and constrained melting (CM), emphasizing the impact of PCTB inclinations on electronics’ thermal control performance. The findings reveal the significant influence of natural convection on CM, compared to CCM. In scenarios with natural convection, the entire melting duration of the CM and CCM in the horizontal PCTB decreases by 21.7% and 2%, respectively. The early melting phase is predominantly governed by heat conduction in both CM and CCM. As the molten PCM increases, natural convection emerges in CM, while mixed convection occurs in CCM. The effect of inclination angle on CM and CCM varies, with the most rapid melting rates observed at 0° for CM and 60° for CCM. The thermal control efficacy of PCTBs in CCM mode surpasses that in CM mode and is less influenced by the inclination angle. Furthermore, electronics exhibit the longest safe operating time (218–227 s) and highest latent heat utilization efficiency (98.6%–100%) with a horizontal PCTB, confirming the superiority of this configuration.