<p>The coating of tungsten powder agglomerates with nickel by chemical deposition from salt solutions was examined. The influence of nickel chloride solution concentration and deposition kinetics on the nickel content and coating thickness were studied. At a NiCl<sub>2</sub> concentration of 30 g/l, approximately 8% nickel was deposited on the tungsten powder agglomerates, while an increase in the NiCl<sub>2</sub> concentration to 60 g/l raised the deposited nickel content to 80%. Kinetic studies of the deposition process over 60–120 min showed that the nickel content reached 20–22% after 60 min. When the deposition time was extended to 90 min, the nickel content increased to 75–80%. The effect of tungsten powder agglomerate sizes on the nickel chemical deposition process was examined, and differences in the coating caused by varying specific surface areas of the agglomerates were established. Finer agglomerates with sizes of 20–25 μm, with larger specific surface areas, exhibited increased contact between the neighboring particles and reduced contact with the solution, which limited complete nickel coverage. Larger agglomerates, with significantly smaller specific surface areas, showed a nickel layer 5–7 μm thick. The influence of nickel coating on the morphology of tungsten particles was studied; the powder physical and process characteristics changed (flowability decreased from 2.33 sec/50 g to 2.64 sec/50 g and bulk density from 7.77 g/cm<sup>3</sup> to 6.51 g/cm<sup>3</sup>). The effect of isothermal holding time during sintering of compacts produced from nickel-coated tungsten powders was established. During radiation sintering with prolonged holding times, recrystallization of tungsten particles occurred through the liquid phase, leading to tungsten grain growth by a factor of 2.5–3. During electron beam sintering with short holding times, no recrystallization of tungsten particles occurred, resulting in a fine structure with a grain size of approximately 20 μm without the formation of intermetallic compounds.</p>

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Use of Composite Powders to Produce Heavy Tungsten-Based Alloys by Radiation and Electron Beam Sintering

  • K. V. Polishchuk,
  • A. V. Minitskyi

摘要

The coating of tungsten powder agglomerates with nickel by chemical deposition from salt solutions was examined. The influence of nickel chloride solution concentration and deposition kinetics on the nickel content and coating thickness were studied. At a NiCl2 concentration of 30 g/l, approximately 8% nickel was deposited on the tungsten powder agglomerates, while an increase in the NiCl2 concentration to 60 g/l raised the deposited nickel content to 80%. Kinetic studies of the deposition process over 60–120 min showed that the nickel content reached 20–22% after 60 min. When the deposition time was extended to 90 min, the nickel content increased to 75–80%. The effect of tungsten powder agglomerate sizes on the nickel chemical deposition process was examined, and differences in the coating caused by varying specific surface areas of the agglomerates were established. Finer agglomerates with sizes of 20–25 μm, with larger specific surface areas, exhibited increased contact between the neighboring particles and reduced contact with the solution, which limited complete nickel coverage. Larger agglomerates, with significantly smaller specific surface areas, showed a nickel layer 5–7 μm thick. The influence of nickel coating on the morphology of tungsten particles was studied; the powder physical and process characteristics changed (flowability decreased from 2.33 sec/50 g to 2.64 sec/50 g and bulk density from 7.77 g/cm3 to 6.51 g/cm3). The effect of isothermal holding time during sintering of compacts produced from nickel-coated tungsten powders was established. During radiation sintering with prolonged holding times, recrystallization of tungsten particles occurred through the liquid phase, leading to tungsten grain growth by a factor of 2.5–3. During electron beam sintering with short holding times, no recrystallization of tungsten particles occurred, resulting in a fine structure with a grain size of approximately 20 μm without the formation of intermetallic compounds.