Reaction Pathways Between SnH4 and SnH Relevant to EUV Lithography: A DFT and TST Study
摘要
Tin contamination in extreme ultraviolet lithography (EUVL) optics can be partially removed from radical-mediated reactions in hydrogen plasmas by formation of the volatile produce stannane (SnH4). Using density functional theory (DFT) and transition state theory (TST), we examine two competing SnH4-SnH radical pathways–channel 1 (Sn2H3 + H2) and channel 2 (Sn2H5)--that influence downstream tin deposition. Distinct bonding mechanisms render channel 1 endothermic and tunneling-sensitive, while channel 2 is exothermic, spontaneous, and kinetically dominant under process conditions. These findings provide molecular-level guidance for predicting plasma-driven tin species fluxes to optical surfaces, offering a basis for optimizing contamination control in the EUVL systems.