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<p>The porous aerostatic spindle, a key component in wafer grinding machines, exhibits time-varying dynamic behaviors–including vibration, dynamic stiffness, and damping–that critically affect wafer surface roughness during self-rotational grinding. To address the limited understanding of these dynamics under grinding conditions, this study proposes a bidirectional fluid–structure interaction cross-scale modeling approach. A transient dynamic framework is established by coupling compressible gas flow within the aerostatic bearing with the nonlinear dynamic response of the rotor, enabling comprehensive analysis of the time-dependent evolution of bearing performance and rotor vibrations under the combined effects of gas film forces, grinding forces, and gravity. To validate the proposed model's accuracy and the influence of coupling on grinding, a kinematic-based wafer surface roughness prediction model was developed, incorporating time-varying grinding wheel vibrations and abrasive particle removal mechanisms. The model predictions show a close match with experimental results, with a deviation of only 5.09%. Based on this validated framework, the study further explores the effects of structural and process parameters on the spindle’s dynamic time-varying characteristics. Parametric analyses reveal that gas film thickness predominantly governs fluctuations in load capacity, dynamic stiffness, damping, and vibration amplitude, while permeability and bearing thickness exert secondary effects. Among process variables, rotor vibration amplitude significantly increases at spindle speeds above 3200&#xa0;r/min, whereas the impact of load capacity variations on rotor vibration remains minimal. This work offers valuable theoretical insights and practical guidance for the structural design and process optimization of porous aerostatic spindles in high-precision wafer grinding applications.</p>

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Study on the time-varying dynamic characteristics of porous aerostatic spindle in wafer self-rotational grinding based on bidirectional fluid–structure interaction

  • 期刊论文

  • 发表日期：

    2026年4月15日

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  • Jiahui Xu,
  • Xianglong Zhu,
  • Yindi Cai,
  • Lihao Dai,
  • Zhigang Dong,
  • Renke Kang,
  • Jiasheng Li,
  • Guohua Zhang,
  • Hailong Cui

摘要

The porous aerostatic spindle, a key component in wafer grinding machines, exhibits time-varying dynamic behaviors–including vibration, dynamic stiffness, and damping–that critically affect wafer surface roughness during self-rotational grinding. To address the limited understanding of these dynamics under grinding conditions, this study proposes a bidirectional fluid–structure interaction cross-scale modeling approach. A transient dynamic framework is established by coupling compressible gas flow within the aerostatic bearing with the nonlinear dynamic response of the rotor, enabling comprehensive analysis of the time-dependent evolution of bearing performance and rotor vibrations under the combined effects of gas film forces, grinding forces, and gravity. To validate the proposed model's accuracy and the influence of coupling on grinding, a kinematic-based wafer surface roughness prediction model was developed, incorporating time-varying grinding wheel vibrations and abrasive particle removal mechanisms. The model predictions show a close match with experimental results, with a deviation of only 5.09%. Based on this validated framework, the study further explores the effects of structural and process parameters on the spindle’s dynamic time-varying characteristics. Parametric analyses reveal that gas film thickness predominantly governs fluctuations in load capacity, dynamic stiffness, damping, and vibration amplitude, while permeability and bearing thickness exert secondary effects. Among process variables, rotor vibration amplitude significantly increases at spindle speeds above 3200 r/min, whereas the impact of load capacity variations on rotor vibration remains minimal. This work offers valuable theoretical insights and practical guidance for the structural design and process optimization of porous aerostatic spindles in high-precision wafer grinding applications.