<p>In this paper, an investigation was conducted on the temperature–time dependence of the electrical durability of high-pressure polyethylene (HPPE) films. The role of organic additives, phthalic anhydride and phthalic acid, was identified. The additive content in HPPE compositions was adjusted with a range from 0.01 to 0.1 mass percent. Results show that incorporating appropriate amounts of these additives increases the electrical strength of HPPE films by approximately 50% compared to unmodified HPPE. Measurements were also conducted on the electrical strength of HPPE films and their modified compositions under varying mechanical stress levels. The activation energy of electrical breakdown (<InlineEquation ID="IEq1"> <InlineMediaObject> <ImageObject Color="BlackWhite" FileRef="11043_2025_9780_Article_IEq1.gif" Format="GIF" Height="14" Rendition="HTML" Resolution="72" Type="Linedraw" Width="16" /> </InlineMediaObject> <EquationSource Format="MATHML"><math> <mi>U</mi> </math></EquationSource> <EquationSource Format="TEX">$U$</EquationSource> </InlineEquation>) and its intrinsic value (<InlineEquation ID="IEq2"> <InlineMediaObject> <ImageObject Color="BlackWhite" FileRef="11043_2025_9780_Article_IEq2.gif" Format="GIF" Height="16" Rendition="HTML" Resolution="72" Type="Linedraw" Width="19" /> </InlineMediaObject> <EquationSource Format="MATHML"><math> <msub> <mi>U</mi> <mn>0</mn> </msub> </math></EquationSource> <EquationSource Format="TEX">$U_{0}$</EquationSource> </InlineEquation>) remained consistent across both unmodified HPPE and its optimally modified forms. However, modifications with phthalic anhydride and phthalic acid altered the structure-sensitive coefficient (<InlineEquation ID="IEq3"> <InlineMediaObject> <ImageObject Color="BlackWhite" FileRef="11043_2025_9780_Article_IEq3.gif" Format="GIF" Height="17" Rendition="HTML" Resolution="72" Type="Linedraw" Width="15" /> </InlineMediaObject> <EquationSource Format="MATHML"><math> <mi>β</mi> </math></EquationSource> <EquationSource Format="TEX">$\beta $</EquationSource> </InlineEquation>), reflecting changes in HPPE properties. The value of <InlineEquation ID="IEq4"> <InlineMediaObject> <ImageObject Color="BlackWhite" FileRef="11043_2025_9780_Article_IEq2.gif" Format="GIF" Height="16" Rendition="HTML" Resolution="72" Type="Linedraw" Width="19" /> </InlineMediaObject> <EquationSource Format="MATHML"><math> <msub> <mi>U</mi> <mn>0</mn> </msub> </math></EquationSource> <EquationSource Format="TEX">$U_{0}$</EquationSource> </InlineEquation> aligns with the activation energy of chemical bonds, indicating that electrical breakdown in these polymers primarily occurs through bond disruption.</p>

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The influence of organic additives phthalic anhydride and phthalic acid on the temperature–time dependencies of the electrical strength of HPPE films

  • Matanat Ahmed Mehrabova,
  • Surayya Isa Mammadova,
  • Sevinj Ittifag Safarova,
  • Farhad Shamil Kerimov,
  • Shafiqa Mohammad Mehdiyeva

摘要

In this paper, an investigation was conducted on the temperature–time dependence of the electrical durability of high-pressure polyethylene (HPPE) films. The role of organic additives, phthalic anhydride and phthalic acid, was identified. The additive content in HPPE compositions was adjusted with a range from 0.01 to 0.1 mass percent. Results show that incorporating appropriate amounts of these additives increases the electrical strength of HPPE films by approximately 50% compared to unmodified HPPE. Measurements were also conducted on the electrical strength of HPPE films and their modified compositions under varying mechanical stress levels. The activation energy of electrical breakdown ( U $U$ ) and its intrinsic value ( U 0 $U_{0}$ ) remained consistent across both unmodified HPPE and its optimally modified forms. However, modifications with phthalic anhydride and phthalic acid altered the structure-sensitive coefficient ( β $\beta $ ), reflecting changes in HPPE properties. The value of U 0 $U_{0}$ aligns with the activation energy of chemical bonds, indicating that electrical breakdown in these polymers primarily occurs through bond disruption.