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<p>In this paper, conjugate phenomenon under transient conditions in microchannel heat sinks was experimentally investigated. Metal plates of copper, brass and stainless steel material consist of 18 circular channels were used for the purpose. The length and diameter of each fabricated channel was (40 ± 0.4)&#xa0;mm and (400 ± 09)&#xa0;<i>μ</i>m, respectively. Water and ethanol were used as coolant. Flow rates and heat input ranged from 1.92 to 8.82&#xa0;g min<sup>−1</sup> and 0.19–1.56&#xa0;W cm<sup>−2</sup>. Transient conditions for greater length of time were realized under favourable conditions of backward conduction. Temperature rise during early time of experimentation was observed to be dominant over the period when the system is approaching steady state. A maximum of 3–4 times rise in temperature of coolant at inlet was observed till steady state for copper substrate relative to stainless steel. Moreover, a maximum of about 15&#xa0;°C rise in temperature of water at inlet location was observed when investigated with copper substrate at Re = 13. Experimental results indicated importance of considering the phenomenon during transient operation in most cases. Such studies will be useful in designing microsystems during start-up, shutdown as well as change in operating conditions.</p>

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Experimental analysis of backward conduction under transient conditions

  • 期刊论文

  • 发表日期：

    2026年4月18日

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  • Nishit Bedi

摘要

In this paper, conjugate phenomenon under transient conditions in microchannel heat sinks was experimentally investigated. Metal plates of copper, brass and stainless steel material consist of 18 circular channels were used for the purpose. The length and diameter of each fabricated channel was (40 ± 0.4) mm and (400 ± 09) μm, respectively. Water and ethanol were used as coolant. Flow rates and heat input ranged from 1.92 to 8.82 g min−1 and 0.19–1.56 W cm−2. Transient conditions for greater length of time were realized under favourable conditions of backward conduction. Temperature rise during early time of experimentation was observed to be dominant over the period when the system is approaching steady state. A maximum of 3–4 times rise in temperature of coolant at inlet was observed till steady state for copper substrate relative to stainless steel. Moreover, a maximum of about 15 °C rise in temperature of water at inlet location was observed when investigated with copper substrate at Re = 13. Experimental results indicated importance of considering the phenomenon during transient operation in most cases. Such studies will be useful in designing microsystems during start-up, shutdown as well as change in operating conditions.