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<p>With the rapid advancement of microelectronic technology, traditional cooling methods are increasingly unable to meet the thermal dissipation demands under high heat flux densities. The compact design and enhanced thermal performance of microchannel heat sinks (MCHSs) have made them a promising solution for efficient thermal management. This review summarized recent progress in enhancing MCHS performance through structural optimization, biomimetic design, and nanofluids augmentation. Modifications to microchannel geometry, incorporation of cavities and ribbed structures, and multilayered channel configurations have been shown to effectively expand the heat transfer area and induce flow disturbances. Inspired by natural structures such as leaf veins, honeycombs, and spiderwebs, biomimetic designs further improve temperature uniformity and flow characteristics. Concurrently, nanofluids, owing to their high thermal conductivity and Brownian motion effects, are widely utilized for heat transfer enhancement, though challenges related to increased viscosity and stability persist. The synergistic integration of biomimetic architectures with nanofluids demonstrates superior thermal performance, achieving an optimized balance among heat transfer coefficient, pressure drop, and temperature uniformity. Finally, this paper outlined future directions including adaptive cooling with hydrogels, artificial intelligence-driven optimization, and sustainable manufacturing, offering theoretical insights for next-generation thermal management systems in high-power electronic devices.</p>

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Research progress of the application of microchannels, bionic structures and nanofluids in the thermal management of electronic components

  • 期刊论文

  • 发表日期：

    2026年1月23日

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  • Jinyang Luo,
  • Cong Qi,
  • Yan Li

摘要

With the rapid advancement of microelectronic technology, traditional cooling methods are increasingly unable to meet the thermal dissipation demands under high heat flux densities. The compact design and enhanced thermal performance of microchannel heat sinks (MCHSs) have made them a promising solution for efficient thermal management. This review summarized recent progress in enhancing MCHS performance through structural optimization, biomimetic design, and nanofluids augmentation. Modifications to microchannel geometry, incorporation of cavities and ribbed structures, and multilayered channel configurations have been shown to effectively expand the heat transfer area and induce flow disturbances. Inspired by natural structures such as leaf veins, honeycombs, and spiderwebs, biomimetic designs further improve temperature uniformity and flow characteristics. Concurrently, nanofluids, owing to their high thermal conductivity and Brownian motion effects, are widely utilized for heat transfer enhancement, though challenges related to increased viscosity and stability persist. The synergistic integration of biomimetic architectures with nanofluids demonstrates superior thermal performance, achieving an optimized balance among heat transfer coefficient, pressure drop, and temperature uniformity. Finally, this paper outlined future directions including adaptive cooling with hydrogels, artificial intelligence-driven optimization, and sustainable manufacturing, offering theoretical insights for next-generation thermal management systems in high-power electronic devices.