Scholarlink

<p>In order to maintain system longevity and performance, creative cooling solutions are required due to the growing thermal challenges in electronic systems. In this work, a novel microchannel heat sink (MCHS) design that combines triangular cavities and wavy walls (WMCHS-WTC) is presented. In this work, a novel microchannel heat sink design with triangular cavities and wavy walls (WMCHS-WTC) is evaluated using AlO<sub>3</sub>/H<sub>2</sub>O nanofluids. To compare the thermal and hydraulic performance of WMCHS-WTC with that of a traditional rectangular microchannel heat sink (RMCHS) under the same conditions, a dual-model experimental setup was created. Experiments and numerical simulations were conducted across Reynolds numbers (Re) ranging from 200 to 1000, heat fluxes between 50 and 200&#xa0;W, and nanofluid volume concentrations from 0% to 0.05%. Results show that WMCHS-WTC significantly enhances heat transfer, achieving a 20% reduction in average wall temperature and a 66% increase in the Nusselt number at Re = 1000 and 0.05 vol% nanofluid concentration. Friction factor analysis showed a 26% increase for WMCHS-WTC at 0.04 vol% concentration compared to 15% for RMCHS. Thermal resistance typically decreases with increasing Re number and volume concentration for both types of MCHS, but it also depends on the design of the MCHS, where the findings show that the thermal resistance in WMCHS-WTC is lower than in RMCHS. The lowest thermal resistance value is 0.075&#xa0;°C/W (at Re = 1000, <i>P</i> = 200&#xa0;W, 0.04% volume concentration) in WMCHS-WTC, and the weakest in RMCHS is 0.115 at the same conditions. This is the first experimental and numerical study to integrate dual geometries in a single test section, offering a scalable and efficient solution for next-generation electronics cooling.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Experimental and numerical analysis of hydrothermal performance in wavy microchannel heat sink with nanofluids for advanced cooling systems

  • 期刊论文

  • 发表日期：

    2026年1月7日

查看全文
  • Nehad Abid Allah H,
  • Isam Mejbel Abed,
  • Nejla Mahjoub Said

摘要

In order to maintain system longevity and performance, creative cooling solutions are required due to the growing thermal challenges in electronic systems. In this work, a novel microchannel heat sink (MCHS) design that combines triangular cavities and wavy walls (WMCHS-WTC) is presented. In this work, a novel microchannel heat sink design with triangular cavities and wavy walls (WMCHS-WTC) is evaluated using AlO3/H2O nanofluids. To compare the thermal and hydraulic performance of WMCHS-WTC with that of a traditional rectangular microchannel heat sink (RMCHS) under the same conditions, a dual-model experimental setup was created. Experiments and numerical simulations were conducted across Reynolds numbers (Re) ranging from 200 to 1000, heat fluxes between 50 and 200 W, and nanofluid volume concentrations from 0% to 0.05%. Results show that WMCHS-WTC significantly enhances heat transfer, achieving a 20% reduction in average wall temperature and a 66% increase in the Nusselt number at Re = 1000 and 0.05 vol% nanofluid concentration. Friction factor analysis showed a 26% increase for WMCHS-WTC at 0.04 vol% concentration compared to 15% for RMCHS. Thermal resistance typically decreases with increasing Re number and volume concentration for both types of MCHS, but it also depends on the design of the MCHS, where the findings show that the thermal resistance in WMCHS-WTC is lower than in RMCHS. The lowest thermal resistance value is 0.075 °C/W (at Re = 1000, P = 200 W, 0.04% volume concentration) in WMCHS-WTC, and the weakest in RMCHS is 0.115 at the same conditions. This is the first experimental and numerical study to integrate dual geometries in a single test section, offering a scalable and efficient solution for next-generation electronics cooling.