<p>Fluorescent screen has garnered significant attention due to its excellent electro-optical conversion property, but there are few studies on solving the phenomenon of optical feedback and inter-electrode discharge caused by external stray light. In this paper, new self-design gold alloy paste carried out gold alloy film preparation experiment on fluorescent screen, and a comprehensive testing system is used to analyze the sintered products of gold alloy paste, the composition and properties of film. The results of TG-MS and TG-FTIR reveal that the main gaseous products escape from gold alloy paste include H<sub>2</sub>O, C<sub>10</sub>H<sub>18</sub>O, C<sub>4</sub>H<sub>8</sub>O<sub>2</sub>, NO<sub>2</sub> and CO<sub>2</sub> during sintering at 25–450&#xa0;℃. SEM equipped with EDS confirms that Au, Ag, Bi and Cr elements are uniformly distributed on film. The composition of 13% film is quantitatively analyzed by ICP-OES, which contains 12.19% Au, 0.35% Ag, 0.05% Bi, 0.01% Cr and 0.39% sulfonate. In addition, the transmittance of film is 0.1– 0.6%. The average resistivity is 2.81 × 10<sup>–6</sup>&#xa0;Ω&#xa0;cm. The average adhesion is 6.86&#xa0;MPa. Overall, gold alloy film with high purity and low residue has excellent light shielding, conductivity and adhesion, which can effectively prevent the entry of external stray light.</p>

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The volatilization of organic matter in the sintering process of gold alloy paste

  • Lulu Li,
  • Zhen Zhang,
  • Ziyuan Zhong,
  • Youyi Xu,
  • Zhipeng Li,
  • Wenhuai Tian

摘要

Fluorescent screen has garnered significant attention due to its excellent electro-optical conversion property, but there are few studies on solving the phenomenon of optical feedback and inter-electrode discharge caused by external stray light. In this paper, new self-design gold alloy paste carried out gold alloy film preparation experiment on fluorescent screen, and a comprehensive testing system is used to analyze the sintered products of gold alloy paste, the composition and properties of film. The results of TG-MS and TG-FTIR reveal that the main gaseous products escape from gold alloy paste include H2O, C10H18O, C4H8O2, NO2 and CO2 during sintering at 25–450 ℃. SEM equipped with EDS confirms that Au, Ag, Bi and Cr elements are uniformly distributed on film. The composition of 13% film is quantitatively analyzed by ICP-OES, which contains 12.19% Au, 0.35% Ag, 0.05% Bi, 0.01% Cr and 0.39% sulfonate. In addition, the transmittance of film is 0.1– 0.6%. The average resistivity is 2.81 × 10–6 Ω cm. The average adhesion is 6.86 MPa. Overall, gold alloy film with high purity and low residue has excellent light shielding, conductivity and adhesion, which can effectively prevent the entry of external stray light.