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<p>With the advancement of the semiconductor industry, UV-induced adhesion- reducing adhesives have found widespread application in the manufacturing and processing of wafers. In this paper, a terminal hydroxyl dimer acid-glycidyl methacrylate (DA-GMA) trimer, which is named as DG, was first synthesized by dimer acid (DA) and glycidyl methacrylate (GMA). Subsequently, a bio-based polyurethane UV adhesion-reducing adhesives, which is noted as DGI-UV, was prepared using DG, isophorone diisocyanate (IPDI), cis-2-butene-1,4-diol and photoinitiators, respectively. The correct structure of DG was confirmed via Fourier Transform Infrared Spectroscopy (FT-IR) and Nuclear Magnetic Resonance Hydrogen Spectroscopy (¹H NMR). The effects of NCO/OH molar ratio, the content of cis-2-butene-1,4-diol and photoinitiator (type and content) on the performance of DGI-UV were analyzed. The results indicated that the optimal comprehensive performance of DGI-UV was achieved when the NCO/OH molar ratio was 1.3, the content of cis-2-butene-1,4-diol was 10 wt% of DG, and diphenyl (2,4,6- trimethylphenylformyl) phosphorus oxide (TPO) was selected as the photoinitiator at a content of 3 wt% of the total amount of DA and GMA. Under the optimized conditions, the 180° peel strength of DGI-UV decreased from 25.90&#xa0;N/25&#xa0;mm before UV irradiation to 0.25&#xa0;N/25&#xa0;mm after UV irradiation. Laser confocal 3D measurement microscope images revealed that the surface roughness of the adhesive film increased from 0.04 to 1.28 after UV irradiation. The bio-based polyurethane adhesion- reducing adhesives developed in this study offers both enhanced initial tack and superior peel performance, providing an eco-friendly and efficient new material option for ultra-thin wafer temporary bonding applications.</p>

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Preparation and properties of bio-based polyurethane UV adhesion-reducing adhesives based on dimer acid

  • 期刊论文

  • 发表日期：

    2026年3月25日

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  • Wenjing Li,
  • Haihong Ma,
  • Pingfeng Yang,
  • Zhengfa Zhou,
  • Weibing Xu,
  • Fengmei Ren

摘要

With the advancement of the semiconductor industry, UV-induced adhesion- reducing adhesives have found widespread application in the manufacturing and processing of wafers. In this paper, a terminal hydroxyl dimer acid-glycidyl methacrylate (DA-GMA) trimer, which is named as DG, was first synthesized by dimer acid (DA) and glycidyl methacrylate (GMA). Subsequently, a bio-based polyurethane UV adhesion-reducing adhesives, which is noted as DGI-UV, was prepared using DG, isophorone diisocyanate (IPDI), cis-2-butene-1,4-diol and photoinitiators, respectively. The correct structure of DG was confirmed via Fourier Transform Infrared Spectroscopy (FT-IR) and Nuclear Magnetic Resonance Hydrogen Spectroscopy (¹H NMR). The effects of NCO/OH molar ratio, the content of cis-2-butene-1,4-diol and photoinitiator (type and content) on the performance of DGI-UV were analyzed. The results indicated that the optimal comprehensive performance of DGI-UV was achieved when the NCO/OH molar ratio was 1.3, the content of cis-2-butene-1,4-diol was 10 wt% of DG, and diphenyl (2,4,6- trimethylphenylformyl) phosphorus oxide (TPO) was selected as the photoinitiator at a content of 3 wt% of the total amount of DA and GMA. Under the optimized conditions, the 180° peel strength of DGI-UV decreased from 25.90 N/25 mm before UV irradiation to 0.25 N/25 mm after UV irradiation. Laser confocal 3D measurement microscope images revealed that the surface roughness of the adhesive film increased from 0.04 to 1.28 after UV irradiation. The bio-based polyurethane adhesion- reducing adhesives developed in this study offers both enhanced initial tack and superior peel performance, providing an eco-friendly and efficient new material option for ultra-thin wafer temporary bonding applications.