Mechanically robust PEDOT:PSS/Ti3C2Tx MXene–silver nanowire nanocomposites for high-performance electromagnetic interference shielding
摘要
The rapid advancement of highly integrated and compact electronics has spurred an urgent demand for ultrathin, lightweight, and flexible electromagnetic interference (EMI) shielding materials that combine superior shielding effectiveness (SE) with robust mechanical durability. To address this challenge, we engineered flexible and lightweight composite films composed of MXene nanosheets, 1D silver nanowires (AgNWs), and a conductive PEDOT: PSS polymer via a scalable vacuum-assisted filtration process. The resulted co-continuous segregated structure endows the composite films with exceptional electrical conductivity, mechanical resilience, and outstanding EMI shielding performance. Notably, the ultrathin (0.014 mm) binary MXene/AgNW (1:1) BMA50 composite film achieves an exceptional EMI SE of 65 dB in the X-band (8.2–12.4 GHz), corresponding to a remarkable specific shielding effectiveness (SSE) of 26,784 dB cm2 g−1. Furthermore, the ternary composite film TMA10 (0.032 mm) incorporating MXene, AgNWs, and PEDOT: PSS exhibited an EMI SE of 50 dB with improved mechanical strength (120 MPa) compared to the binary composite with an SSE of 6847 dB cm2 g−1. All fabricated films exhibit a shielding efficiency greater than 99.99%, making them highly suitable for practical applications. The PEDOT:PSS/Ti3C2Tx–AgNW ternary composite exhibited significantly enhanced mechanical performance compared to the MXene–AgNW binary system, achieving a maximum tensile strength of 120 MPa, a Young’s modulus of approximately 2.8 GPa, and superior toughness, owing to the synergistic reinforcement of the conductive polymer and AgNW-bridged MXene network. The synergistic interaction between AgNWs and MXene within the PEDOT:PSS matrix enhances electrical conductivity and forms a porous yet mechanically robust framework, enabling efficient EMI shielding while maintaining flexibility. This scalable strategy offers a promising route for high-performance flexible EMI shielding materials.