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<p>To address the growing demands for advanced thermal management and high-voltage insulation in modern power systems, this study developed a trilayer sandwich-structured polyimide (PI) composite film with a gradient filler distribution. By incorporating silane-functionalized boron nitride nanosheets (BNNs), the design establishes continuous phonon transport networks within the highly loaded middle layer to enhance thermal conductivity. This multilayer structure solves the problem of material insulation deterioration caused by the addition of a large amount of thermal conductive fillers. Experimental results show that the 5 wt% sandwich-structured film achieves a peak breakdown strength of 573.1&#xa0;kV/mm at 25&#xa0;℃, outperforming pristine PI (535.1&#xa0;kV/mm), and maintains a robust 460.1&#xa0;kV/mm even at 150&#xa0;℃. Concurrently, the 8&#xa0;wt% composite delivers a thermal conductivity of 0.317&#xa0;W/(m&#xa0;K), a 138% enhancement over pure PI. This strategy provides a feasible approach for developing high-performance insulation systems for next-generation high-power applications.</p>

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Enhanced thermal conductivity and breakdown strength in trilayer sandwich-structured polyimide/boron nitride nanosheets composite films

  • 期刊论文

  • 发表日期：

    2026年7月29日

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  • Xuanzhi Liu,
  • Chao Yin,
  • Wenjie Liu,
  • Yi Ding,
  • Zeyi Wang,
  • Qingguo Chi

摘要

To address the growing demands for advanced thermal management and high-voltage insulation in modern power systems, this study developed a trilayer sandwich-structured polyimide (PI) composite film with a gradient filler distribution. By incorporating silane-functionalized boron nitride nanosheets (BNNs), the design establishes continuous phonon transport networks within the highly loaded middle layer to enhance thermal conductivity. This multilayer structure solves the problem of material insulation deterioration caused by the addition of a large amount of thermal conductive fillers. Experimental results show that the 5 wt% sandwich-structured film achieves a peak breakdown strength of 573.1 kV/mm at 25 ℃, outperforming pristine PI (535.1 kV/mm), and maintains a robust 460.1 kV/mm even at 150 ℃. Concurrently, the 8 wt% composite delivers a thermal conductivity of 0.317 W/(m K), a 138% enhancement over pure PI. This strategy provides a feasible approach for developing high-performance insulation systems for next-generation high-power applications.