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<p>This work studied the effects of adipic acid on electrochemical migration (ECM) of Sn96.5Ag3.0Cu0.5 (SAC305) solder alloy by thin electrolyte film (TEF) experiments, topography observation, and electrochemical measurements. The results show that under an adipic acid environment, a compact passivation film is formed on the SAC305 surface and there is an absence of dendrite between two electrodes. In TEF condition with 30&#xa0;mM NaCl, the duration of short-circuit failure is 2086.5 ± 87.0&#xa0;s. However, in TEF containing adipic acid and NaCl, the short-circuit failure time caused by dendrite growth was significantly reduced. Specifically, under condition of the TEF containing 30&#xa0;mM adipic acid and 30&#xa0;mM NaCl, the dendritic growth-triggered short-circuit failure time was only 14.5 ± 1.7&#xa0;s. Adipic acid and NaCl exhibit a synergistic effect in promoting electrochemical migration-induced failure of the solder alloy.</p>

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Effects of adipic acid on electrochemical migration of Sn96.5Ag3.0Cu0.5 solder alloy in thin electrolyte film

  • 期刊论文

  • 发表日期：

    2026年8月1日

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  • Pan Yi,
  • Zhen Yang,
  • Junhui Li,
  • Yuchao Ma,
  • Zhenggang Fang,
  • Chaofang Dong

摘要

This work studied the effects of adipic acid on electrochemical migration (ECM) of Sn96.5Ag3.0Cu0.5 (SAC305) solder alloy by thin electrolyte film (TEF) experiments, topography observation, and electrochemical measurements. The results show that under an adipic acid environment, a compact passivation film is formed on the SAC305 surface and there is an absence of dendrite between two electrodes. In TEF condition with 30 mM NaCl, the duration of short-circuit failure is 2086.5 ± 87.0 s. However, in TEF containing adipic acid and NaCl, the short-circuit failure time caused by dendrite growth was significantly reduced. Specifically, under condition of the TEF containing 30 mM adipic acid and 30 mM NaCl, the dendritic growth-triggered short-circuit failure time was only 14.5 ± 1.7 s. Adipic acid and NaCl exhibit a synergistic effect in promoting electrochemical migration-induced failure of the solder alloy.