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<p>With the rapid advancement of electronic components, conductive pastes—environmentally friendly, lead‑free, and capable of low‑temperature processing—have emerged as promising alternatives to traditional tin–lead solders, finding widespread applications in thick‑film circuits, solar cells, light-emitting diodes, and wearable electronics. Among various conductive fillers, silver stands out owing to its outstanding electrical conductivity, remarkable oxidation resistance, and excellent processability. The performance of silver-based conductive paste hinges critically on the size and morphology of the incorporated silver nanoparticles, which govern key properties including electrical conductivity, printability, sintering behavior, and mechanical robustness. This review provides a systematic survey of the synthesis of morphologically controlled silver nanoparticles, including spherical, polyhedral, nanowire, and flake‑like structures, through both chemical and physical routes. Particular emphasis is placed on the thermodynamic and kinetic mechanisms underlying nanoparticle growth. Furthermore, emerging strategies for designing cost‑effective composite fillers, as exemplified by copper–silver core–shell structures, are discussed. Finally, the key prospects and critical challenges confronting the development of advanced metallic fillers for next‑generation high‑performance conductive pastes are outlined.</p>

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Morphology control strategies for silver nanopowders in conductive paste applications

  • 期刊论文

  • 发表日期：

    2026年7月28日

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  • Jie Zhu,
  • Zhanshuai Ma,
  • Huijun He,
  • Xiangqian Yin,
  • Xuehan Lu,
  • Haiyan Zhao,
  • Zhi Li,
  • Dingsheng Wang,
  • Jianwei Wang,
  • Junfeng Liu

摘要

With the rapid advancement of electronic components, conductive pastes—environmentally friendly, lead‑free, and capable of low‑temperature processing—have emerged as promising alternatives to traditional tin–lead solders, finding widespread applications in thick‑film circuits, solar cells, light-emitting diodes, and wearable electronics. Among various conductive fillers, silver stands out owing to its outstanding electrical conductivity, remarkable oxidation resistance, and excellent processability. The performance of silver-based conductive paste hinges critically on the size and morphology of the incorporated silver nanoparticles, which govern key properties including electrical conductivity, printability, sintering behavior, and mechanical robustness. This review provides a systematic survey of the synthesis of morphologically controlled silver nanoparticles, including spherical, polyhedral, nanowire, and flake‑like structures, through both chemical and physical routes. Particular emphasis is placed on the thermodynamic and kinetic mechanisms underlying nanoparticle growth. Furthermore, emerging strategies for designing cost‑effective composite fillers, as exemplified by copper–silver core–shell structures, are discussed. Finally, the key prospects and critical challenges confronting the development of advanced metallic fillers for next‑generation high‑performance conductive pastes are outlined.