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<p>As high-performance chips, wide-bandgap power devices, three-dimensional advanced packages, flexible/wearable electronics, and optoelectronic terminals move toward higher integration density, higher power density, and harsher service environments, thermal management has become a critical reliability issue in electronic materials and packaging architectures. Heat in electronic devices is not conducted through a single material. It is transported across a multilayer thermal pathway that includes the chip, interfacial layer, encapsulation layer, heat-spreading layer, and heat-rejection terminal. Thus, the device temperature rise cannot be assessed from intrinsic thermal conductivity alone. It should be evaluated within a total thermal resistance framework that also considers interfacial thermal resistance, heat-flow direction matching, heat-spreading capability, and packaging boundary conditions. Using an “interfacial coupling–thermal networks–transient buffering–terminal heat rejection–device thermal pathways” framework, this review compares thermal interface materials (TIMs), electrically insulating thermally conductive composites, phase change material (PCM) composites, cooling-interface materials, and representative system-level cooling technologies by thermal-pathway position, dominant thermal resistance, heat-flow direction, device-level benefit, and reliability boundary. Particular attention is given to low-resistance interfacial coupling, oriented thermal networks, transient thermal buffering, terminal or active heat-rejection units, scenario-specific thermal-pathway integration, and thermal–electrical–dielectric reliability constraints. We argue that high-performance electronic thermal management materials should not be designed by maximizing the thermal conductivity alone. Instead, they require a verifiable balance among low total thermal resistance, electrical insulation, dielectric stability, mechanical compatibility, processing compatibility, scalable manufacturability, and long-term reliability. Finally, a failure-mode-aware thermal–electrical–dielectric–mechanical–process–long-term evaluation framework, coupled with reliability and manufacturability considerations, is proposed for realistic packaging conditions in power, advanced, flexible/wearable, outdoor, and high-heat-flux electronics.</p>

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Recent progress in thermal management materials for electronic devices: interfacial thermal resistance regulation, thermal network construction, and device reliability boundaries

  • 期刊论文

  • 发表日期：

    2026年7月17日

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  • Liuyang Wang,
  • Xinyu Lu,
  • Libin Bai

摘要

As high-performance chips, wide-bandgap power devices, three-dimensional advanced packages, flexible/wearable electronics, and optoelectronic terminals move toward higher integration density, higher power density, and harsher service environments, thermal management has become a critical reliability issue in electronic materials and packaging architectures. Heat in electronic devices is not conducted through a single material. It is transported across a multilayer thermal pathway that includes the chip, interfacial layer, encapsulation layer, heat-spreading layer, and heat-rejection terminal. Thus, the device temperature rise cannot be assessed from intrinsic thermal conductivity alone. It should be evaluated within a total thermal resistance framework that also considers interfacial thermal resistance, heat-flow direction matching, heat-spreading capability, and packaging boundary conditions. Using an “interfacial coupling–thermal networks–transient buffering–terminal heat rejection–device thermal pathways” framework, this review compares thermal interface materials (TIMs), electrically insulating thermally conductive composites, phase change material (PCM) composites, cooling-interface materials, and representative system-level cooling technologies by thermal-pathway position, dominant thermal resistance, heat-flow direction, device-level benefit, and reliability boundary. Particular attention is given to low-resistance interfacial coupling, oriented thermal networks, transient thermal buffering, terminal or active heat-rejection units, scenario-specific thermal-pathway integration, and thermal–electrical–dielectric reliability constraints. We argue that high-performance electronic thermal management materials should not be designed by maximizing the thermal conductivity alone. Instead, they require a verifiable balance among low total thermal resistance, electrical insulation, dielectric stability, mechanical compatibility, processing compatibility, scalable manufacturability, and long-term reliability. Finally, a failure-mode-aware thermal–electrical–dielectric–mechanical–process–long-term evaluation framework, coupled with reliability and manufacturability considerations, is proposed for realistic packaging conditions in power, advanced, flexible/wearable, outdoor, and high-heat-flux electronics.