Scholarlink

<p>Copper nanowire (CuNW) networks are promising low-cost alternatives to indium tin oxide for flexible transparent conductive thin films (TCFs), but their practical application is restricted by rapid oxidative degradation and weak adhesion to polymer substrates. Herein, a dual-ZnS-clamped CuNW sandwich TCF was fabricated on polyethylene terephthalate (PET) by combining thermal evaporation with spin-coating. In this architecture, the bottom ZnS layer functions as an interfacial anchoring layer to reinforce the attachment between PET and the CuNW network, while the top ZnS layer serves as a compact passivation barrier against oxygen, moisture, and oxidizing species. By optimizing the ZnS thickness and CuNW spin-coating cycles, the ZnS/CuNW/ZnS sandwich TCF achieves a visible-light transmittance of 84.7% and a sheet resistance of 22.8 Ω/sq, indicating that ZnS confinement preserves the transparency-conductivity balance of the CuNW network. More importantly, the sandwich film exhibits markedly improved reliability under 85&#xa0;°C/85% RH aging, 120&#xa0;°C heating, H<sub>2</sub>O<sub>2</sub> oxidation, ambient storage, tape peeling, ultrasonication, and cyclic bending. After 10,000 bending cycles at a radius of 5&#xa0;mm, only limited resistance variation is observed. This dual-ZnS clamping strategy provides a simple, low-temperature, and scalable route for simultaneously improving the environmental stability, adhesion, and mechanical durability of CuNW-based flexible transparent electrodes.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

ZnS/Cu nanowire/ZnS sandwich thin films for durable flexible transparent conductive electrodes

  • 期刊论文

  • 发表日期：

    2026年7月6日

查看全文
  • Zheng Wu,
  • Zhenzhong Huang,
  • Xiuhuai Jia,
  • Shicai Xu,
  • Jinke Bai,
  • Shihui Yu

摘要

Copper nanowire (CuNW) networks are promising low-cost alternatives to indium tin oxide for flexible transparent conductive thin films (TCFs), but their practical application is restricted by rapid oxidative degradation and weak adhesion to polymer substrates. Herein, a dual-ZnS-clamped CuNW sandwich TCF was fabricated on polyethylene terephthalate (PET) by combining thermal evaporation with spin-coating. In this architecture, the bottom ZnS layer functions as an interfacial anchoring layer to reinforce the attachment between PET and the CuNW network, while the top ZnS layer serves as a compact passivation barrier against oxygen, moisture, and oxidizing species. By optimizing the ZnS thickness and CuNW spin-coating cycles, the ZnS/CuNW/ZnS sandwich TCF achieves a visible-light transmittance of 84.7% and a sheet resistance of 22.8 Ω/sq, indicating that ZnS confinement preserves the transparency-conductivity balance of the CuNW network. More importantly, the sandwich film exhibits markedly improved reliability under 85 °C/85% RH aging, 120 °C heating, H2O2 oxidation, ambient storage, tape peeling, ultrasonication, and cyclic bending. After 10,000 bending cycles at a radius of 5 mm, only limited resistance variation is observed. This dual-ZnS clamping strategy provides a simple, low-temperature, and scalable route for simultaneously improving the environmental stability, adhesion, and mechanical durability of CuNW-based flexible transparent electrodes.