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<p>This study fabricated Cu/SAC305–Cu@Ag–Co/Cu sandwich joints using a network-like intermetallic compound (IMC) soldering process and investigated the effects of Cu@Ag content and nano-Co addition on porosity and shear strength. The results indicate that a Cu@Ag content of 20 wt% produced a continuous network-like IMC skeleton with an IMC volume fraction of 66.9% and low porosity. In contrast, increasing Cu@Ag to 25–30 wt% increased the amount of residual Cu and promoted void formation. Nano-Co exhibited a distinct transition from porosity suppression to aggravation: 0.1–0.3 wt% reduced porosity from 17.9 to 7.75–9.65%, whereas ≥ 0.5 wt% led to a pronounced increase in porosity with concentrated voids. Consistently, 0.1 wt% Co increased the shear strength from 35.1 to 36.8 MPa, while excessive Co caused a sharp decrease to 15.21 MPa. Overall, a composition window of 20 wt% Cu@Ag combined with 0.1–0.3 wt% Co is identified as optimal for balancing joint densification and shear resistance in network-like IMC skeleton solder joints.</p>

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Effect of Cu@Ag and nano-Co on the performance of IMC skeleton solder joints

  • 期刊论文

  • 发表日期：

    2026年7月1日

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  • Hui Jiang,
  • Yujie Guan,
  • Jun Shen,
  • D. Luo,
  • Q. Chen

摘要

This study fabricated Cu/SAC305–Cu@Ag–Co/Cu sandwich joints using a network-like intermetallic compound (IMC) soldering process and investigated the effects of Cu@Ag content and nano-Co addition on porosity and shear strength. The results indicate that a Cu@Ag content of 20 wt% produced a continuous network-like IMC skeleton with an IMC volume fraction of 66.9% and low porosity. In contrast, increasing Cu@Ag to 25–30 wt% increased the amount of residual Cu and promoted void formation. Nano-Co exhibited a distinct transition from porosity suppression to aggravation: 0.1–0.3 wt% reduced porosity from 17.9 to 7.75–9.65%, whereas ≥ 0.5 wt% led to a pronounced increase in porosity with concentrated voids. Consistently, 0.1 wt% Co increased the shear strength from 35.1 to 36.8 MPa, while excessive Co caused a sharp decrease to 15.21 MPa. Overall, a composition window of 20 wt% Cu@Ag combined with 0.1–0.3 wt% Co is identified as optimal for balancing joint densification and shear resistance in network-like IMC skeleton solder joints.